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Elbit Systems Ltd. it was awarded a $112 million contract to supply a country in Asia-Pacific with advanced airborne intelligence systems. The contract will be performed over a six-year period.
"We are pleased to be awarded this contract to supply an intelligence solution that addresses both current and future battlefield requirements. We see a continuous demand for our systems due to our unique capacity to offer comprehensive and agile solutions encompassing platforms, payloads and analysis technologies," said Bezhalel (Butzi) Machlis, Elbit Systems president and CEO.
I-Connect007 Editorial Team
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.
Ranjit Pandher, et al., Alpha Assembly Solutions
Solder voiding is a common phenomenon across all semiconductor packaging and electronic board assemblies. There are many factors that influence void frequency and size. This article focuses on several process, design and materials selection considerations which control or potentially reduce voiding to meet industry and end-market acceptance criteria.
Patty Goldman, I-Connect007
I-Connect007 Editor Patty Goldman interviews one of Alpha Assembly Solution’s solder process experts, Traian Cucu, who is based at Alpha’s R&D center in New Jersey. Traian, along with Morgana Ribas, have played key roles in the development of Alpha’s innovation new low-temperature solder paste process. He also talks about how this solves many of the defects issues that one would see on a SAC assembly process.