TTM Technologies Exhibiting at 2018 HKPCA & IPC Show


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TTM Technologies, Inc. is at the annual International Printed Circuit & APEX South China Fair (2018 HKPCA & IPC Show) at booth 1L01. The Fair is themed "Inspire the Industry. Explore the Infinity,” and runs one more day (until December 7) at the Shenzhen Convention and Exhibition Center in Shenzhen, China. As part of the exhibition, TTM Technologies has also been conducting technical seminars on topics including “PCB Technology for Advanced Driver-Assistance Systems (ADAS),” “mSAP Technology,” and “Liquid Crystal Polymer (LCP) applications for Flex.” TTM Technologies' sales and technical experts are available for product and technical on-site discussions.

“The HKPCA & IPC Show is the major PCB show of the year in Asia, and we look forward to our participation each year as it provides a great opportunity to connect with our regional customers as well as our suppliers, and to showcase our industry leading technologies,” said Kent Hardwick, TTM Technologies’ senior vice president of global sales. “As a PCB and RF components technology leader, TTM Technologies strives to engage early and collaboratively with our customers to inspire innovative solutions for the ever-advancing electronics industry.”

Be sure to stop by the TTM Technologies booth today!

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