January 2019 Issue of SMT007 Magazine Available Now

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Component supplies, prices, and lead times are in a great deal of turmoil. And there are a LOT of moving parts to this set of circumstances, ranging from a sustained increase in demand for parts, to pricing pressures on manufacturers and premature parts obsolescence. All of these factors wreak havoc on electronics manufacturing.

In this month's issue of SMT007 Magazine, we explore the drivers and the coping mechanisms from all points of the supply chain.

Read the January 2019 issue of SMT007 Magazine, now on the virtual newsstand, and available for delivery in your e-mailbox by subscribing here.

Be sure to download the PDF version for future reference.

06/12/2020 | Nolan Johnson, I-Connect007

On June 10, Nolan Johnson spoke with Burak Aksoy, technical service and development scientist for Dow Silicones. Aksoy updated Johnson on the recent introduction of DOWSIL™ EA-3838, a fast-curing adhesive formulated for use in industrial manufacturing and assembly applications.

01/13/2020 | I-Connect007 Editorial Team

The I-Connect007 Editorial Team chats with IPC’s Chris Jorgensen about the advances CFX has made in the past year and where the standard is in the standardization process. Chris also previews the CFX line that will be on display at the upcoming IPC APEX EXPO and shares IPC’s plans on educating and providing support solutions to potential users of CFX to implement it more easily.

12/13/2019 | Barry Matties, I-Connect007

At I-Connect007, we are proud to once again sponsor the STEM Outreach Program at the upcoming IPC APEX EXPO 2020. Another way we support our youth is by sharing the stories of young people who are doing amazing things. Dylan Nguyen is a great student, musician, and creative thinker. Recently, he shared with me the details of his school science fair project, “Kite: Powering the Future,” which solved a problem that he faced. Dylan is a leader with a bright future, and the world is lucky to have kids like him.