RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition

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Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed on the success of the heavy gold deposition process they discussed last year.  Learn how it has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.

To watch the interview, click here.

12/17/2019 | Rick Nichols, Sandra Nelle, Robert Spreemann, and Gustavo Ramos, Atotech Deutschland GMBH

The Tianjin chemical blast in August 2015 sensitized the Chinese authorities to the use of cyanide in production. As a consequence, the authorities have introduced licensing with regard to the use of cyanide. In turn, this has motivated Chinese PCB manufacturers to ask suppliers for a competent cyanide-free immersion gold solution (CNF Au).

12/16/2019 | Pete Starkey, I-Connect007

Since 2016, the Institute of Circuit Technology (ICT) has held its northern area Christmas seminar at the Majestic Hotel in Harrogate—the elegant and historic English spa town in North Yorkshire. Pete Starkey provides an overview of this popular ICT event.

12/02/2019 | Nolan Johnson, PCB007

Nolan Johnson talks with Brian Hess of Calumet Electronics and Mike Vinson of Averatek about the new, insertable additive processes that the companies are working on together to help factories running primarily subtractive processes to quickly convert to very high-density interconnect (HDI) features, including trace and space from 2.5-mil line and space to 1-mil line and space and below.