RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition

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Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed on the success of the heavy gold deposition process they discussed last year.  Learn how it has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.

To watch the interview, click here.

10/15/2019 | Kelly Dack

Kelly Dack and Tara Dunn talk about the upcoming conference "Additive Electronics: PCB Scale to IC Scale" on October 24, 2019, hosted by SMTA in San Jose, California, and why it's an important event for people to attend—especially those involved in the design process.

10/03/2019 | Pete Starkey, I-Connect007

Meriden has been established as a popular Midlands venue for Institute of Circuit Technology (ICT) meetings. On September 19, a multitude of Fellows, Members, and Associates gathered for the Institute’s autumn seminar, which was organised and hosted by ICT Technical Director Bill Wilkie. The agenda included five informative technical presentations, describing current research and development on significant topics relevant to the industry.

10/02/2019 | John Coonrod, Rogers Corporation

Data will be presented for loss versus frequency for six different plated finishes commonly used in the PCB industry, and opinions will be offered as to why the loss behavior differs for the different plated finishes and for the different circuit configurations. Because the insertion loss of high-frequency circuits also depends on substrate thickness, circuits fabricated on substrates with different thicknesses will be evaluated to analyze the effects of substrate thickness on insertion loss.