-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Meet Industry Experts at the 2019 International Electronics Circuit Exhibition (Shenzhen)!
November 15, 2019 | HKPCAEstimated reading time: 1 minute
The International Technical Conference, to be held concurrently with the 2019 International Electronics Circuit Exhibition (Shenzhen) (formerly International Printed Circuit & APEX South China Fair), gives you valuable insights on the latest market trends to prepare you to face challenges and transform your business to a new level. Join us for the Conference at the Shenzhen Convention & Exhibition Center, China, 4-6 December 2019.
Stay on top with the industry leaders and experts
The 2019 Conference will feature international specialists and industry experts to address the hottest topics covering both market trend and technical updates of the industry. Here are some hot sessions that you can't miss!
- Keynote Speeches from Mr Canice Chung and Mr. You Lei, Chairmen HKPCA
- The Challenge and Opportunity of 5G High Frequency to PCB and PCBA, Mr. Liu Zhe Chief Engineer, ZTE Corporation
- Which Way is the PCB Industry Heading? Dr. Hayao Nakahara, President, N.T. Information Ltd.
- PCB Market Update, Dr. Shiuh-Kao Chiang, Managing Partner, Prismark
- IC Substrate Technology Characteristics Study, Mr. Lin Ting Hao, Sr. Project Director, Kinsus Interconnect Technology Corp.
- Challenges and Opportunity to PCB Material and Processing Technology from Automotive Electronics, Mr. James Tam, Project Manager, Robert Bosch Co., Ltd.
Get the latest show news at HKPCAshow.org.
Suggested Items
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Real Time with... IPC APEX EXPO 2024: Going Vertical: SCHMID's Advanced Solutions for Printed Circuit Boards
04/24/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont chats with Bob Ferguson, the president of SCHMID, about advanced solutions for PCBs and the equipment they are highlighting at this year's show. He delves into vertical no-touch handling systems and the prospect of achieving sub-10-micron lines. Inspired by SCHMID's technology, Bob expresses excitement about where the industry is today.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
Zentech’s Board of Directors Announces the Return of Matt Turpin as President and CEO
04/22/2024 | Zentech ManufacturingTurpin draws upon over 35 years of experience in the electronics industry and has an 18-year history with Zentech. He previously served as President and CEO from 2006 to 2019 after which time he has remained active in the EMS industry as an advisor to Zentech and other industry organizations.
Aaron Woolf, Dylan Peterson Join SIA Team
04/22/2024 | SIAThe Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.