AerNos Named CES 2020 Innovation Award Honoree in Two Categories
January 6, 2020 | PRWEBEstimated reading time: 1 minute
AerNos, Inc. has announced that it has been named a CES 2020 Innovation Awards Honoree in two categories for its air quality monitoring module developed for integration into smart IoT connected products. An annual program that celebrates outstanding design, the CES Innovation Awards recognizes honorees across 28 product categories. A panel of judges, including designers, engineers and members of the tech media, reviews submissions based on design, functionality, consumer appeal, engineering and how the products compare with competition. CES 2020 takes place January 7-10 in Las Vegas.
AerNos nano gas sensor modules detect multiple gases simultaneously to parts per billion (PPB) levels for indoor and outdoor air quality monitoring, hazardous gas detection and other e-nose applications. AerNos leverages breakthroughs in nanotechnology, engineering, AI and manufacturing to deliver an embeddable plug-and-play product for integration into 3rd party IoT devices, wearable and mobile products. Tiny, low power and affordable, AerNos sensor modules address crucial gaps in the gas sensor market and will accelerate the integration of air quality monitoring and gas detection sensors into smart devices worldwide.
“We are absolutely thrilled to have our game changing product selected as a CES 2020 Innovation Award Honoree, and we are especially proud to receive awards in these particular categories,” said AerNos Founder and CEO Sundip R. Doshi. “With a tiny multi-gas sensing product capable of ppb level detection, we are opening up endless possibilities for our B2B customers and positioning AerNos to fulfill the promise of dense networks of sensors for hyper-local actionable data to improve health, safety and the environment.
The CES Innovation Awards are sponsored by the Consumer Technology Association (CTA)™, owner and producer of CES, the world’s largest and most influential technology event. CTA has been recognizing achievements in product design and engineering since 1976.
AerNos CEO, Sundip R. Doshi will be a panelist on the Smart Home Session: Can Smart Homes Improve Our Health Wednesday, January 8 from 10:15 a.m. – 11:15 a.m., Venetian, Level 4, Marcello 4406.
AerNos will exhibit at CES 2020 at the Sands Expo Booth 42137, January 7-10 in Las Vegas.
The AerNos sensor module will be on display in the Innovation Awards Showcase at CES 2020 as well as in the AerNos booth 42137 in the Sands Expo. To learn about AerNos at CES or to schedule a meeting during CES 2020 visit AerNos at CES.
Suggested Items
Real Time with... IPC APEX EXPO 2024: Exploring IPC's PCB Design Courses with Kris Moyer
04/18/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and IPC instructor Kris Moyer discuss IPC's PCB design training and education offerings. They delve into course topics such as design fundamentals, mil/aero, rigid-flex, RF design, and advanced design concepts. They also highlight material selection for high-speed design, thermal management, and dissipation techniques. The interview wraps up with details about how to access these courses online.
Cadence Unveils Palladium Z3 and Protium X3 Systems
04/18/2024 | Cadence Design SystemsThe Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
On the Line With... Podcast Talks With Cadence Expert on Manufacturing
04/18/2024 | I-Connect007In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.