-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
UP Media Group Issues Call for Abstracts for PCB West 2020
January 16, 2020 | UP Media GroupEstimated reading time: 1 minute
UP Media Group Inc. seeks abstracts for PCB West 2020, to be held September 8-11, 2020, in Santa Clara, CA. The event includes a four-day technical conference and one-day exhibition to be held at the Santa Clara (CA) Convention Center.
PCB West annually provides a conference and exhibition focused on the design and manufacture of PCBs, HDI, electronics assembly and circuit board test. The event annually attracts nearly 2,000 attendees.
Papers and presentations of the following durations are sought for the technical conference: one-hour lectures and presentations; two-hour workshops; and half-day (3.5 hour) and full-day seminars. Preference is given to presentations of 2 hours in length or more, and no presentations of less than one hour will be considered.
Suggested paper and presentation topics include:
Design
• RF and microwave design
• Signal integrity
• LED design and assembly
• High-speed, high-frequency design
• Flex circuit design
• Component placement
• EMI/EMC analysis
• Thermal analysis and management
• HDI design
• PCB design/layout basics
• Component library creation and management
• Design for manufacture
• Packaging design
• Mixed-signal design
• Area arrays
• FPGA design and implementation
• Design team collaboration
Fabrication
• PCB fabrication
• Flexible circuit manufacturing
• HDI
• Surface finishes
• Embedded passives and active devices
• Industry forecasts, and business and supply chain issues
Assembly
• Electronics assembly
• New component packaging
• Screen and stencil printing
• Component placement
• Soldering and materials
• Test and inspection
• Environmental legislation (REACH, RoHS2, etc.) and its effects
• Industry forecasts, and business and supply chain issues
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology.
Abstracts of 100 to 300 words and speaker biographies should be submitted to UP Media Group at https://pcbwest.com/abstract-submission-guidelines by February 24, 2020.
Anyone may submit an abstract to present a course at PCB West 2020, and presenters may present more than one paper or teach more than one course. A separate abstract must be submitted for each course.
If selected, a detailed presentation outline and final paper or presentation is due August 13, 2020.
For more information about PCB West, visit pcbwest.com or contact Director of Group Shows, Alyson Corey at 678-234-9859; acorey@upmediagroup.com.
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.