Flexible Thinking: Additive Manufacturing of PCBs

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“It’s hard to make predictions, especially about the future.” –Yogi Berra

Yogi Berra and several other more scientifically minded individuals (including no less than pioneering physicist Nils Bohr) have been proven right time and again with their simple but astute observations about predicting the future. The future is indeed very difficult to predict, but certain things can be intuited with a modicum of logic and a bit of wild-eyed speculation. Some fellow soldiers and I, serving with the 101st Airborne, “invented” what is now called virtual reality (VR) and/or augmented reality (AR) in Vietnam 50 years ago during some of our less frenetic off-hours. It was based on our steel pot helmets, and it had a curved display that gave a 180° field of view and speakers placed around it that provided 3D sound (we did not, however, envision stereoscopic vision to provide 3D imaging, as I recall).

Of course, we had no way to implement our outrageous ideas because the technologies required to support our collective vision were not available until now. I am willing to assert without proof that there were likely others who may have had a similar and contemporary inspiration. Most certainly, there have been numerous others who have had similar ideas since, as evidenced by the Oculus VR headset, which is now available.

We are seeing increasing interest in technologies that will allow one to make electronic substrates in near real-time using additive processing techniques and 3D printers. It is a true game-changer in product development. The surge in interest in additive manufacturing technologies shown in recent times—as indicated by the significant increase in published articles and press releases—suggests that the electronic interconnection manufacturing industry could be on the verge of a manufacturing renaissance.

To read this entire column, which appeared in the November 2019 issue of Design007 Magazine, click here.

08/11/2022 | Andy Shaughnessy, Design007 Magazine

We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In this first part of the roundtable, the participants dispel 10 common myths that have been floating around regarding printed electronic circuits (PEC). They also discuss the progress that’s been made in PEC development in just the past decade, and what the future may hold for this technology.

11/19/2021 | Nolan Johnson, I-Connect007

I recently spoke with Jamin Taylor, vice president of sales and marketing at All Flex Flexible Circuits in Minnesota. We discussed the company’s recent merger with Printed Circuits Inc., and some creative new flex applications, including flexible heaters and catheters for the medical field. As Jamin explains, "It’s always interesting to see different technologies amongst different companies. We’re working on a few new applications and products, like being able to do some fine lines and flex materials, but with large format, a longer format than usual. Some of their capabilities with lasering and fine features really help with our long flex capability; when we merge the two, we see a new market being created for that technology."

03/02/2021 | Pete Starkey, I-Connect007

For the first time since its foundation in 1974, the Institute of Circuit Technology had no alternative than to conduct its Annual General Meeting online. The event, which took place on February 25, 2021, was remarkably well-attended, and was followed, as is traditional, by a technical seminar. The seminar became a webinar focused on novel materials and methods for printed circuit fabrication and moderated by ICT Chair Emma Hudson.