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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/15/2024 | Andy Shaughnessy, Design007 Magazine
It was a busy week in PCB design and manufacturing. This has been a pretty “dense” week, and this week’s Top Five features an article on density equations by Happy Holden, and a news item about the SMTA UHDI symposium in Phoenix. We also have news about our latest podcast, and a Chris Mitchell column about economic security here and abroad. And Todd Kolmodin discusses the ins and out of 4-wire Kelvin testing, and he tells us a little about Lord Kelvin himself. 

The Shaughnessy Report: The Myriad Opportunities—and Challenges

03/12/2024 | Andy Shaughnessy -- Column: The Shaughnessy Report
If you look at the current state of PCB design, there are a lot of positive indicators. We have almost full employment in this great career that appeals to the techie side of the brain as well as the artistic side. You can make good money as a designer without ever seeing the inside of a college. This segment is in constant flux. It’s challenging, and that’s part of what makes it fun. But there’s one big problem: There aren’t enough designers, and the problem is likely to get worse before it gets better.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/15/2023 | Andy Shaughnessy, Design007 Magazine
We’ve had a hot week in this industry. In my picks for this week, we introduce a new SMT007 columnist, and we have a look at the CHIPS Act one year later. We have a great article about sourcing diversification, and a look at the latest electronics news coming out of India. And columnist Vern Solberg explains DFM best practices for flexible circuits.

TopLine to Present at IMAPS Symposium 2023

08/11/2023 | TopLine
Martin Hart, CEO of TopLine Corporation, will deliver a presentation titled “Reliable Solder Columns to Replace Solder Balls in Large 2.5D Heterogeneous Packages” at IMAPS 2023 in San Diego, California, October 4, 2023.

TopLine to Present at NASA ETW June 13

06/05/2023 | TopLine
Martin Hart, CEO of TopLine Corporation, will deliver a presentation titled “Next Generation Solder Columns Extend Life for Large Packages for Space Applications and Data Centers” at the upcoming 14th Annual NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop (ETW) June 13.
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