STMicroelectronics Acquisitions Strengthen Wireless Connectivity Capabilities of STM32 Microcontrollers
July 17, 2020 | SMTMicroelectronicsEstimated reading time: 1 minute
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announces the signing of two M&A agreements related to the acquisitions of the entire share capital of Ultra Wide Band specialist BeSpoon and of the cellular IoT connectivity assets of Riot Micro. After closing of the two transactions, subject to customary regulatory approvals, ST will further strengthen its offer for wireless connectivity and, in particular, the roadmap for its STM32 microcontrollers and secure MCUs.
BeSpoon, based in Le Bourget du Lac, France, is a fabless semiconductor company founded in 2010 and specialized in Ultra Wide Band (UWB) communications technology. Their technology enables secure real-time indoor location with centimeter accuracy in environments under adverse conditions. The integration of this key secure positioning technology in the STM32 product portfolio will enable developers of IoT, automotive and mobile communication applications to provide services such as secure access, and precise indoor & outdoor mapping. ST will acquire BeSpoon from its majority shareholder, TRUMPF, and from its founders. In parallel with the transaction, ST and TRUMPF will enter into a strategic partnership for UWB tracking technology.
Riot Micro, based in Vancouver, Canada, designs cellular IoT solutions by applying proven design techniques from Bluetooth Low Energy (BLE) and Wi-Fi to LTE Cat-M and NB-IoT to optimize system cost and power. The integration of cellular communication capabilities into the STM32 portfolio will strengthen ST’s offer for customers developing applications such as asset tracking, metering, and fleet management services.
Suggested Items
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
Altair Acquires Cambridge Semantics, Powering Next-Generation Enterprise Data Fabrics and Generative AI
04/22/2024 | AltairAltair a global leader in computational intelligence, acquired Cambridge Semantics, a modern data fabric provider and creator of one of the industry’s leading analytical graph databases.
Absolute EMS Champions Collaboration Between Humans and Robots in Modern Manufacturing
04/19/2024 | Absolute EMS, Inc.Absolute EMS, Inc., an award-winning EMS provider of turnkey contract manufacturing services, offers a perfect factory environment that seamlessly blends robotic automation with human expertise.
Microsoft, Google Join as Sponsors for First-Ever AI Expo for National Competitiveness
04/19/2024 | SCSPThe Special Competitive Studies Project (SCSP), a non-partisan, non-profit project dedicated to strengthening America’s long-term competitiveness in artificial intelligence (AI), announced today two additional sponsors of the AI Expo for National Competitiveness.
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations