-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Rogers Introduces RO4450T Glass Reinforced Thermoset Multi-Thickness Bondply
August 31, 2020 | Rogers CorporationEstimated reading time: 1 minute
Wireless circuit designers can now enjoy a true breakthrough with Rogers Corporation's RO4450T™ bondply. This product offers designers a spread glass reinforced bonding material in seven thickness options ranging between 0.0025” (0.064mm) and 0.006” (0.152mm), greatly improving flexibility for high multilayer board count designs.
RO4450T glass reinforced thermoset bondplies were developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 materials. The thermosetting hydrocarbon ceramic resin system facilitates a high post cure Tg, making these materials an excellent choice for multilayers requiring sequential laminations as fully cured RO4400 bondplys are capable of handling multiple lamination cycles.
In addition, FR-4 compatible bond requirements permit RO4450T bondply and low flow FR-4 bondply to be combined into non-homogeneous multilayer constructions using a single bond cycle. RO4450T bondplys are recognized by Underwriter Laboratories with the UL 94 V-0 flame rating, and are compatible with lead-free processes.
About Rogers Corporation
Rogers Corporation is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, e-Mobility and renewable energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com.
Suggested Items
Groundbreaking Ceremony Marks the Beginning of a New Era for Newccess Industrial; The Construction of the MINGXIN Building
04/12/2024 | Newccess IndustrialOn a clear and sunny day in March, the groundbreaking ceremony for the MINGXIN Building took place in Shenzhen, China. This moment marked the official commencement of construction for a project that will reshape the semiconductor materials industry.
The Need for a Holistic Global Sustainability Standard
04/10/2024 | Michael Ford, Aegis SoftwareNo one can deny that the resources of our fragile planet are finite. The environment seems like a third party, subject to constant degradation. We’re acutely aware of the effects of pollution on our climate, and despite our “throw-away” culture, recycling and recovery of materials has remained relatively expensive, even as we use more energy just to survive.
iNEMI Publishes Four Roadmap Topics
04/04/2024 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI) announces the availability of the first roadmap topics in the new iNEMI Roadmap format. Printed circuit boards, sustainable electronics, smart manufacturing, and mmWave materials and test are now available online.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
Checking In With ICAPE Group
04/03/2024 | Nolan Johnson, I-Connect007ICAPE Group’s field application engineer Erik Pederson drills down on sustainability, supply chain resiliency, and what value engineering really looks like in this exclusive interview. Founded in 1999, European-based ICAPE Group provides 21 million printed circuit boards and over six million technical parts to manufacturers every month. With 30 PCB manufacturing partners globally and 50 partners providing a wide array of technical parts, ICAPE Group has operations in China, Taiwan, Thailand, South Korea, Vietnam, South Africa, Europe, Mexico, and the United States. The company also focuses on the value proposition for its customers.