MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan
September 3, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global leader in high performance semiconductor chemistries and assembly materials, will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.
MacDermid Alpha will highlight its entire portfolio of technologies from its MacDermid Enthone, Alpha, Kester, and Compugraphics brands essential to advanced semiconductor packaging and the markets it enables. MacDermid Alpha will be showcasing its recently released MacDermid Enthone brand, Systek UVF 100; a 2-in1 RDL via filling technology for IC substrates, and the Systek ETS 1200; an advanced DC acid copper pattern plating process specifically formulated for the construction of embedded trace substrates.
The Alpha brand STAYDRY Z20 film, a unique getter which employs an active desiccant for water absorption dispersed in a flexible silicone polymer matrix and the Kester brand of Thermal Interface Materials used to enhance heat transfer across the interface between a heat source and heatsink will also be promoted. ?The Compugraphics brand will showcase their complete line of photomask solutions.
MacDermid Alpha’s team of industry experts from its Circuitry and Semiconductor divisions will be available at booth I2422 to discuss the challenges the semiconductor manufacturing sector faces as technology continues to push the limits of performance and miniaturization. Stop by the booth to learn of MacDermid Alpha’s offerings in the 5G, mobile, smart automotive, and high-performance computing markets.
Suggested Items
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources:
Matrix to Exhibit at IPC APEX EXPO 2024 in Anaheim, CA
03/05/2024 | MatrixMatrix will be exhibiting at IPC APEX EXPO 2024, to be held on April 9-12, 2024, at the Anaheim Convention Center, Anaheim, CA.
The Chemical Connection: Getting to Know Your Vendor
02/16/2024 | Don Ball -- Column: The Chemical ConnectionAfter working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
EIPC Winter Conference 2024, Day 2: A Closer Look at Global Trends
02/14/2024 | Pete Starkey, I-Connect007The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.