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Tualatin, Oregon-based Pentalogix, which has been working closely with Gerber format developers Ucamco for years, had already successfully implemented Gerber X2. They now follow suit with the implementation of component layer output. The component layer output has been fully verified by Ucamco, who confirm it conforms to the X3 specification.
A team of people in CAD, CAM and EMS developed Gerber X3 with a single goal in mind: to provide a robust, standardized method for automatically transferring assembly information from design to EMS.
Gerber X2 already fully covered the automatic transfer of information from design to fabrication, in a simple and unequivocal manner. Gerber X3 extends Gerber to assembly, covering the complete EMS process. By using existing syntax and graphics capabilities of X2, Gerber X3 is highly compatible and maintains the trademark simplicity for which Gerber has always been known.
Nolan Johnson, I-Connect007
At the recent IPC Advanced Packaging Symposium, Dr. Frank W. Gayle, deputy director of the Advanced Manufacturing National Program Office, an interagency team with core staff hosted at the U.S. National Institute of Standards and Technology (NIST), gave a presentation on the work NIST has recently undertaken in support of both the semiconductor and R&D sectors, and the CHIPS and Science Act.
Kim DiCianni, IPC
The IPC APEX EXPO mobile app provides everything attendees could possibly need for the event, including viewing exhibitors, sessions, speakers, and products. Need information on an exhibiting company? With the IPC APEX EXPO mobile app, you can look up exhibitors by company name and search by product category—it’s that simple.
I-Connect007 Editorial Team
IPC, a global electronics manufacturing industry association, has acquired media company I-Connect007, a global source for news and original content serving the printed circuit design, fabrication and assembly/EMS markets.