ScoutCam Receives U.S. Patent Allowance for PCBs in Camera Technology


Reading time ( words)

Medigus Ltd. a technology company engaged in advanced medical solutions and innovative internet technologies,  announced it was informed that ScoutCam Inc. Medigus’ affiliate company and a leading developer and manufacturer of customized micro visual solutions and supplementary technologies, received a patent notice of allowance by the United States Patent and Trademark Office, covering, among other things, ScoutCam’s innovative design of Printed Circuit Boards (PCBs), which is included in the camera head. This technology covered by the notice would enable ScoutCam to design and manufacture smaller scale cameras than its competitors per given sensor. 

ScoutCam used this technology for the design of its second-generation camera for NASA, which was used in-orbit during its third Robotic Refueling Mission (RRM3) on October 19th-22nd, 2020.

The unique technology enabled the Company to be selected at the United States Government's international tender bid for the design and production of this camera. In addition to its miniature size, the versatile micro ScoutCam 8.0 HD camera features state of the art customizable optics and noteworthy image quality.

Furthermore, the ability to down scale the camera's diameter carries distinct benefits in the medical device context, in which minimizing an object upon entry into the body - in this case the camera - provides a vital advantage. ScoutCam intends to use this technology to further develop and sell cameras to medical device manufacturers, especially for disposable endoscopes – a market that conducts approximately 75 million endoscopies each year in the U.S. alone – as well as for minimally invasive surgical endoscopic procedures that afford even higher margins.

“As we are engaged in designing and manufacturing innovative novel products, a strong IP portfolio is essential. This notice of allowance for the patent further strengthens our broad IP portfolio. We see this approval as another testimony to our innovation as well as the acceptance we witness by industry leaders, such as NASA and others," said Yaron Silberman, PhD MBA, Chief Executive Officer of ScoutCam.

Share




Suggested Items

Organizing Materials Differently at Ventec

03/29/2023 | Pete Starkey, I-Connect007
At a recent industry conference, technical editor Pete Starkey caught some time with Ventec’s Mark Goodwin and Didier Mauve. In this conversation, Mark and Didier discuss Ventec’s work to curate their product offerings into functional categories based on function and target application. The pair also share their thinking on markets which they see as driving material development work. When material performance becomes an integral part of the PCB’s performance specifications, the traditional way of categorizing materials may not do the job.

A Quantic Leap into Foils and Embeddeds With John Andresakis

03/29/2023 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy talks with John Andresakis about how the merger of resistive foil technologies from Ohmega and Ticer has evolved under the new ownership of Quantic. Andresakis also shares how these materials are finding new applications, especially in the embedded component application space, as the company reaches out to the new generation of PCB designers and design engineers.

A Promising Future for Automation

03/21/2023 | Christopher Bonsell, Chemcut
This year, I had the great opportunity to come to IPC APEX EXPO in San Diego as a contributing member in Chemcut’s booth. Being an exhibitor is always interesting because you never know what you will learn or who you will meet. Truly, it seems that every IPC APEX EXPO is an eye-opening experience. This was the second show I attended, and last year I was amazed to see how in-depth and interconnected the electronics industry is. Seeing how many different companies contribute to manufacturing today’s core technology never fails to impress me.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.