Just Ask Tara Dunn: DFM for Flex and Rigid-Flex
November 6, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Omni PCB President Tara Dunn’s turn! A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. Tara is the co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”
Q: Flex designers don’t seem to pay much attention to a fabricator’s limitations. What would you advise new flex designers as far as DFM?
A: Knowing your fabricator’s limitations is important, whether that be for rigid PCBs or flexible circuits. And this is especially important with flexible circuit designs. There is a wide range of capabilities across the supply base. Some focus on simple flex, single-sided, double-sided, or low layer counts. Others focus on high-complexity technology, including complex rigid-flex and bookbinder technology. It is critical to really understand your fabricator’s capabilities and design to those capabilities.
As important, in a general sense, is to understand that flexible circuit fabrication, while similar to rigid PCB fabrication, has subtle differences that impact things, such as minimum line width and space and hole size. Not only are the layers thinner, with considerations needed for handling and processing, but the materials themselves are less stable than traditional rigid materials, with subtle shifts in material size through processing and changing environmental conditions. These things impact registration during fabrication, and feature sizes that may be common in rigid PCB fabrication may not be the “standard” for flexible circuit designs. Communication is king.
To submit your questions for Tara, click here.
Suggested Items
Keynote Preview: Reshaping our Engagement With the World
03/28/2024 | Shawn DuBravac, IPCThe widespread integration of AI across various sectors is broadening its impact, from revolutionizing healthcare with Smart solutions to transforming homes into intuitive spaces, highlighting its crucial role in boosting efficiency and addressing complex challenges. In healthcare, we're witnessing a trend toward personalized care with AI-driven devices like intelligent pillows to mitigate snoring, sophisticated sleep monitors, and innovative patient monitoring systems.
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Accenture Invests in Sanctuary AI to Bring AI-Powered, Humanoid Robotics to Work Alongside Humans
03/27/2024 | BUSINESS WIREAccenture has made a strategic investment, through Accenture Ventures, in Sanctuary AI, a developer of humanoid general-purpose robots that are powered by AI and can perform a wide variety of work tasks quickly, safely and effectively.
AT&S Well Prepared to Benefit from AI Boom
03/26/2024 | AT&SThe rapid progress in the development of artificial intelligence promises to revolutionize all areas of daily life in the coming years. In order to operate such AI systems, an enormous amount of computing power is required, which is provided by a vast network of data centres.
The IMAPS Show: A Conversation with John Andresakis
03/26/2024 | Marcy LaRont, PCB007 MagazineOn the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.