-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
High-Tech, High-Value Cleaning Answers Made Easy With KYZEN’s Tech-2-Tech
November 19, 2020 | Pete Starkey, I-Connect007Estimated reading time: 2 minutes
Thanks to KYZEN’s Tech-2-Tech initiative, I’ve been taking the opportunity to broaden my knowledge of the fundamentals of cleaning electronic assemblies.
Tech-2-Tech offers a wide-ranging selection of well-chosen topics, covering diverse aspects of selecting, evaluating, operating, and maintaining cleaning processes. These were clearly explained in a series of focused 15-minute sessions, each one presented by a different member of KYZEN’s team of industry experts. It’s amazing how much practical information can be effectively transferred and explained in a 15-minute slot, especially one that’s cleverly designed to fit conveniently into the working day with minimum disruption and includes time to grab a coffee!
The series began back in July, led by KYZEN Executive Vice President Tom Forsythe exploring the expectations of a cleaning process and the relative merits of short-term evaluation versus extended field trial for real-life characterisation. “Cleaning products must clean,” he remarked, “Cleaning agents must touch the dirt, and contaminants must be managed.”
Without getting buried in scientific detail, Forsythe described traditional cleaning technology and compared it with the complexity of soils currently encountered, the consequent complexity of the processes required to remove them, and the critical importance of effective rinsing. “It’s about balance and strength—enough solvency power to clean and enough pH to manage the soils and keep them in solution.”
Forsythe also discussed the dynamics of the cleaning process, particularly when operating in a real-world scenario, and the value of gathering and reviewing all the data from a trial before making production decisions. “It’s a long journey, with some ups and downs and some bends in the road. Some days, it rains!”
Subsequent sessions have included discussion of the five forces of cleaning; the significance of pH and how to maintain it; the importance of rinsing; the causes, consequences, and avoidance of foaming; optimisation of cleaner concentration; manual concentration monitoring and the benefits of automated monitoring; determination of process bath life, and overcoming the challenges of cleaning under low-stand-off tight-pitch components.
Recordings of all of these past sessions are readily accessible on-demand online, together with downloads of the corresponding Q&A sessions—practical answers to sensible questions! And, of course, the KYZEN team are always available to respond to any further queries which may subsequently arise.
Still to come, on December 3 at 3:18 p.m. GMT and December 4 at 1:33 a.m. GMT (the alternative time slots to align with North American, European, and Asian time zones) will be Jack Reinke’s session on the environmental impact of a PCB cleaning agent: its potential effect on the waste stream and whether or not to put spent process solution down the drain. A definite date for our diaries!
For those whose primary interest is metal finishing, KYZEN provided a full alternative programme with each session focused on a specific aspect of cleaning in metal finishing. To KYZEN’s great credit, the Tech-2-Tech initiative provides an intelligently constructed agenda of no-nonsense practical information, advice, and guidance for the benefit of decision-makers, engineers, and technical staff engaged in electronics assembly.
Presented in plain language with interesting analogies, KYZEN’s webinar supplies a wealth of valuable information, presented in an informal and easily assimilated style, with intelligent answers to intelligent questions, refreshingly free from commercial promotion.
I have greatly enjoyed the experience and look forward to the next chapter.
Register today at Tech2TechbyKYZEN.COM.
Suggested Items
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
The Connection Between Wire Harness and Box Build
04/17/2024 | Nolan Johnson, I-Connect007Christina Rutherford is a technical lead and expert in materials engineering at Honeywell, where her specialty is the design, specification, and manufacture of cables and wire harnesses. Rutherford also sits on the committee for IPC/WHMA-A-620. In this conversation, we explore the changing dynamics in wire harnesses and how they relate to box build. Christina’s standards work allows her to draw insightful parallels between wire harness and box build.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Connect the Dots: Designing for Reality: Prioritizing Manufacturability
04/11/2024 | Matt Stevenson -- Column: Connect the DotsRealistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. To do so, one must account for the production variables associated with individual manufacturing partners. Understanding and creating robust PCB designs, especially in terms of board manufacturing, requires a lot of attention to detail. When more detail is included in the design, the manufacturing process goes more smoothly, and process yields are higher.