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The IMAPS Show: A Conversation with John Andresakis

03/26/2024 | Marcy LaRont, PCB007 Magazine
On the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.

TRI Launches New Advanced Packaging 3D CT AXI Solution

03/26/2024 | TRI
Test Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.

IMAPS Wrap-up: AI, Chiplets, and 3D Cube Architecture

03/22/2024 | Marcy LaRont, PCB007 Magazine
The International Microelectronics Assembly and Packaging Society, IMAPS, held its 20th Device Packaging Expo and Conference this past week in Fountain Hills, Arizona, followed immediately by a ‘Workshop on Advanced Packaging for Medical Electronics’ that continued through the remainder of Thursday. Fortunate to find myself in Texas earlier in the week, I made it for the last day of the IMAPS event and attended two excellent keynote presentations by AMD and Intel, respectively. Here are some highlights.

Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

03/18/2024 | IPC
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry. 

Expanded Semiconductor Assembly and Test Facility Database Tracks OSAT and Integrated Device Manufacturers in 670 Facilities

03/18/2024 | SEMI
The new edition of the Worldwide Assembly & Test Facility Database expands coverage to 670 facilities, 33% more than the previous release, including 500 outsourced semiconductor assembly and test (OSAT) service providers and 170 integrated device manufacturer (IDM) facilities, SEMI and TechSearch International announced.
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