-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Würth Elektronik Switching to More Sustainable Packaging
November 27, 2020 | Wurth ElektronikEstimated reading time: 1 minute
Logistics at one of Europe’s biggest manufacturers of electronic and electromechanical components has declared war on packaging waste. Würth Elektronik is putting all goods packaging processes to the test. The internal goals: drastic reduction of plastics and a switch to more sustainable materials.
Many waste-reducing measures have already been realized or are being implemented: For example, Würth Elektronik's Logistics only uses filling material based on recycled paper and also minimizes consumption by using hold-down devices and separating boxes. Padded envelopes are plastic-free, paper-based parcel tape holds parcels together where necessary, and boxes with lids save on adhesive tape. Plastic bags are being replaced by parchment paper bags on a large scale, for example for the delivery documents on the outside of parcels.
On the occasion of the European Week for Waste Reduction (Nov. 21-29, 2020) says Georgios Stamos, Head of Logistics in Waldenburg, Environmental Officer in Logistics at Würth Elektronik eiSos: "According to the German Federal Environment Agency, per capita packaging consumption has increased by 17.9 percent since 2010. Of this, more than half is caused by industry and commerce. So we are looking closely where we can become more sustainable. We are currently evaluating cardboard boxes that consist of up to 50 percent grass. In doing so, we are facing up to special requirements: Because we, as a developer service provider, offer free samples and design kits with replenishment, and this makes for a large number of small shipments. This service should be maintained, of course, but will be provided more sustainably in the future. Both here and elsewhere, protecting our environment involves a multitude of coordinated steps, which come with costs for the company. But the reduction of packaging waste is a responsibility that we as the workforce and company are happy to accept with great commitment.”
Suggested Items
The IMAPS Show: A Conversation with John Andresakis
03/26/2024 | Marcy LaRont, PCB007 MagazineOn the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.
TRI Launches New Advanced Packaging 3D CT AXI Solution
03/26/2024 | TRITest Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.
IMAPS Wrap-up: AI, Chiplets, and 3D Cube Architecture
03/22/2024 | Marcy LaRont, PCB007 MagazineThe International Microelectronics Assembly and Packaging Society, IMAPS, held its 20th Device Packaging Expo and Conference this past week in Fountain Hills, Arizona, followed immediately by a ‘Workshop on Advanced Packaging for Medical Electronics’ that continued through the remainder of Thursday. Fortunate to find myself in Texas earlier in the week, I made it for the last day of the IMAPS event and attended two excellent keynote presentations by AMD and Intel, respectively. Here are some highlights.
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
03/18/2024 | IPCDevan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.
Expanded Semiconductor Assembly and Test Facility Database Tracks OSAT and Integrated Device Manufacturers in 670 Facilities
03/18/2024 | SEMIThe new edition of the Worldwide Assembly & Test Facility Database expands coverage to 670 facilities, 33% more than the previous release, including 500 outsourced semiconductor assembly and test (OSAT) service providers and 170 integrated device manufacturer (IDM) facilities, SEMI and TechSearch International announced.