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The newer industry-standard SerDes protocols such as PCIe Gen6, USB4, and the 100G per-lane Ethernet and OIF/CEI standards offer an increasing challenge for PCB designers on multiple fronts. On the one hand, the speeds are approximately doubling for each generation. At the same time, the circuit board material used is often the same as the previous generations in order to keep costs down. To compensate for the increased loss at higher data rates, complex equalization techniques are employed.
From an IC design perspective, deciding what types of equalization circuits need to be incorporated in the transceivers design, has cost, power, and silicon area implications. From an EDA perspective, the large variety of compliance methods and ways to define equalization types along with their associated transfer functions and constraints leads to increased complexity of the analysis tools.
This Siemens paper will highlight some important aspects of the most popular interconnect specifications, with a focus on the reference equalizers.
To download this free white paper, click here.
Nolan Johnson, I-Connect007
Nolan Johnson recently spoke with Brad Griffin, product marketing director for Cadence Design Systems, about Cadence’s Matrix solver technology. They discuss its use as a multi-disciplinary field solver as well as Cadence’s focus on thermal analysis and utilizing the power of the cloud.
Andy Shaughnessy, Design007
I-Connect007 columnist John Watson is teaching an introductory class on PCB design at Palomar College this fall, but this is much more than a basic design class. But John has hit a slight snafu: He needs a few more students to sign up before Aug. 23, or the class will be cancelled. It’s an online class, so you don’t have to live in San Diego to attend. In this interview, John talks about the genesis for the class and its benefits.
I-Connect007 Editorial Team
I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.