-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
ATS’ CPU Cooler for Dense PCBs Pulls in Air from Four Directions
February 17, 2022 | Advanced Thermal Solutions, Inc.Estimated reading time: 1 minute
Advanced Thermal Solutions, Inc. (ATS) is now providing quadFLOW active CPU coolers, designed to cool high powered chips in densely filled locations. quadFLOW active coolers pull air from four directions to maximize thermal performance where airflow is limited, and conventional cooling solutions are ineffective.
Many 1U and 2U servers have constrained internal airflow. This can make cooling today's highest-performing Intel, AMD and Nvidia chips difficult. If a cooling system can’t effectively manage chip heat, a processor may reduce its speed for safety, which can compromise computer performance. ATS quadFLOW coolers, drawing cooling air from four directions, are ideal for cooling such 1U and 2U systems and capable of handling a max TDP of 160W. Cooling performance is 20% higher than other coolers.
Provided standard with PEM attachment hardware, quadFLOW coolers are designed to precisely fit the ILM (Independent Loading Mechanism) retention device on Intel LGA 2011 (Socket R) and newer LGA 2066 (Socket R4) CPU sockets. The PEMs align with the mounting hole patterns in the LGA 2011 and LGA 2066 square ILM (80 x 80 MM) CPU sockets. An ATS backing plate allows quadFLOW’s use with AMD, Nvidia and other non-intel CPUs.
The blowers on quadFLOW active CPU coolers have a PWM (pulse width modulation): 10.8 VDC ~ 13.2 VDC operating voltage, with an MTBF of 598,000 hours measured at 40oC. When weight is an issue, choose quadFLOW coolers with aluminum fins. For higher performance, copper fins are available. When higher cooling levels are needed, quadFLOW coolers can be paired with a vapor chamber base.
quadFLOW coolers come with pre-attached Parker Chomerics high performance (3.0 W/m-k thermal conductivity) T670 thermal grease. T670 supports high power applications requiring minimum bond line thickness.
Suggested Items
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources:
Matrix to Exhibit at IPC APEX EXPO 2024 in Anaheim, CA
03/05/2024 | MatrixMatrix will be exhibiting at IPC APEX EXPO 2024, to be held on April 9-12, 2024, at the Anaheim Convention Center, Anaheim, CA.
The Chemical Connection: Getting to Know Your Vendor
02/16/2024 | Don Ball -- Column: The Chemical ConnectionAfter working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
EIPC Winter Conference 2024, Day 2: A Closer Look at Global Trends
02/14/2024 | Pete Starkey, I-Connect007The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.