Book Excerpt: 'The Printed Circuit Designer’s Guide to… High Performance Materials', Chapter 1
March 17, 2022 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Evolution of the Resin System
Most basic resin systems have been around for a long time. Here is a little timeline of developments through more recent introductions.
- In 1907, the first laminate was made with pure phenolic resin by Westinghouse in Pittsburgh, Pennsylvania. Formica became the first true sheet laminate.The first application—a radio by Paul Eisler in 1936—led to practical manufacturing for military radios in the U.S., and use of single-sided copper-clad phenolic laminate started in about 1943 using paper and cotton as the structural component. Epoxy resin was introduced shortly after in 1947.
- Still reigning as the lowest loss resin system, a PTFE, RT/Duroid® was introduced in 1949.
- The first polyimide was discovered in 1908 by Bogart and Renshaw. However, the high heat-resistant polyimide laminate material was brought to the market in 1951.
- Isola began production of copper-clad laminate in 1956.
- Epoxy-based laminate systems followed around 1960 and used woven E-glass fabric.
- Shortly after, G-10 epoxy laminate (non-flame retardant epoxy resin plus E-glass) and a flame-retardant epoxy version called FR-4 (flame-retardant epoxy resin plus E-glass) were introduced in 1968.
From that time forward, there have been various blends, such as PPO (polyphenylene oxide)/epoxy, CE (cyanate ester)/epoxy, and polyimide/epoxy, that were created to balance properties of pure resin systems to achieve specific enhanced properties. Each new resin system was built on learning from previous products. Resin system developments for high heat applications such as LED lighting, ultra-thin non-reinforced films for capacitance and halogen-free systems to meet RoHS and REACH environmental requirements, continue to be developed to address the performance and reliability needs. With each new need, laminate material manufacturers go into the lab and see what new raw material can be used to improve resin system performance.
The process of developing a new resin system requires deep knowledge of how the PCB will be manufactured. PCB designers are most concerned with assembly process capability, long term reliability, thermal cycling performance, CAF resistance, and electrical performance, therefore, all these attributes must be balanced within the design of a resin system. The market requirements mean that laminate manufacturers must continue to research available options that will provide incremental improvements to the resin system performance.
Suggested Items
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources:
Matrix to Exhibit at IPC APEX EXPO 2024 in Anaheim, CA
03/05/2024 | MatrixMatrix will be exhibiting at IPC APEX EXPO 2024, to be held on April 9-12, 2024, at the Anaheim Convention Center, Anaheim, CA.
The Chemical Connection: Getting to Know Your Vendor
02/16/2024 | Don Ball -- Column: The Chemical ConnectionAfter working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
EIPC Winter Conference 2024, Day 2: A Closer Look at Global Trends
02/14/2024 | Pete Starkey, I-Connect007The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.