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Nominations opened for the Phil Kaufman Hall of Fame for Distinguished Contributions to Electronic System Design sponsored by the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA).
The honor posthumously recognizes individuals who made significant and noteworthy contributions through creativity, entrepreneurism and innovation to the electronic system design industry and were not recipients of the Phil Kaufman Award. Deceased members of the community are not eligible to receive the Phil Kaufman Award, a policy set by the IEEE.
Selections for the Hall of Fame are determined through a nomination process. Nominations are reviewed by the ESD Alliance and IEEE CEDA Kaufman Award selection committees. A special Phil Kaufman Hall of Fame page on the ESD Alliance and IEEE CEDA websites will host photos, citations and tributes to the selected inductees.
The nomination period runs through Friday, April 29, and inductees will be announced in June. The link to the nomination form can be found here. Nominations submitted in 2021 will be valid through 2023.
Inaugural honorees awarded in 2021 were Jim Hogan, executive, angel investor and board member, and Stanford University Professor Edward J. McCluskey, acknowledged for their significant and noteworthy contributions to the electronic system design industry.
I-Connect007 Editorial Team
I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.
Andy Shaughnessy, Design007 Magazine
Electrical and mechanical engineers may be working on the same product development teams, but they speak different languages, and they have completely different objectives. As a result, these folks almost never use the same software tools.
But Cadence’s new Celsius Thermal Solver is an exception to the rule. In a new CadenceTECHTALK webinar, “How Static and Dynamic IR Drop Analysis Can Help PCB Designs and Challenges,” product manager Melika Roshandell and SerDes SI/PI engineer Karthik Mahesh Rao explain how the EE and ME can both use the Celsius Thermal Solver to achieve their disparate objectives.
Zachariah Peterson, NWES
Today’s PCB design engineers have more layout and analysis tools at their disposal than ever before. Over the years we’ve seen layout tools become more automated, rules-driven, and more integrated. Now we even have integration between design tools from different vendors and ranging across domains, starting with basic circuit design, and spanning up to PLM and ERP integration. It really is a great time to be a designer.