Excerpt: 'The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2'
August 2, 2022 | Didier Mauve and Robert Art, VentecEstimated reading time: 1 minute
Introduction
The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art of Ventec International Group is the second in a two-part series. This book builds on the material presented in the first by describing up-to-the-minute products and design techniques for thermal management with IMS.
The first volume comprehensively covers principles of heat transfer and modeling of thermal systems to help engineers quantify the thermal-management challenges in the application at hand, the nature of IMS, typical material parameters, and the choices available for designers to reach the desired performance.
We recommend reading the first book in order to understand the issue from first principles, how to navigate the many material choices offered, and appreciate how adjusting the various combinations of material types and thicknesses can help you arrive at a solution that meets your requirements from all standpoints, particularly system reliability, size, cost, and manufacturability.
The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, covers additional use cases and materials, including those used for high-temperature applications as well as high-emissivity surface treatment that can significantly enhance thermal performance. A web-based thermal calculator is demonstrated, which helps arrive at the exact size of baseplate needed to achieve the desired thermal performance in the smallest possible volume—much smaller than would be possible using a suitably sized heatsink.
Volume 2 delves deeper into issues such as test methods and how these can affect assessments of IMS materials and analyzes the effects of tolerances in material properties and thickness on the overall thermal conductivity. Understanding this can critically influence measurement error, ultimately determining whether or not an accurate result for reliability can be calculated. The authors look at how problems such as solder cracks affect thermal performance, and share application examples showing design with multilayer IMS.
As application challenges have evolved, and new component types and thermal materials have entered the market, there is more to say about thermal management and the options available to designers striving for an effective, economical, and compact solution to meet system-reliability targets.
To continue reading this book from the I-007eBooks library, download it today!
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation are proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia. on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.