Reading time ( words)
High Density Packaging (HDP) User Group is pleased to announce that Mitsui Mining & Smelting Co., LTD. (Mitsui Kinzoku) has become a member.
Mitsui Kinzoku has been contributing to worldwide society by providing various valuable products. One of those products is copper foil. The company focuses primarily on high-end applications in each electronics field, such as advanced packaging and high-speed communications. The company expects that their materials knowledge will be utilized in several HDP projects.
“I am pleased to welcome Mitsui Kinzoku to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in high-performance copper foil, especially for high-frequency and high-speed applications, will contribute significantly to several of our emerging technology projects”, said Larry Marcanti, Executive Director of HDP User Group.
Share
Suggested Items
05/10/2023 |
Pete Starkey, I-Connect007
It’s been a little while since I first had the opportunity to review an EIPC Technical Snapshot webinar. This excellent series began in October 2020 when our industry was besieged by the COVID-19 pandemic. It has continued successfully as restrictions have lifted and provides an effective channel for the efficient sharing of relevant knowledge that complements the traditional live conferences. The 20th in the series, in December 2022, focused on environmental issues impacting the electronics industry. In early February, EIPC held its live Winter Conference in Lyon and now, by popular demand, the 21st Technical Snapshot fills a slot before the Summer Conference scheduled for mid-June in Munich.
03/29/2023 |
Pete Starkey, I-Connect007
At a recent industry conference, technical editor Pete Starkey caught some time with Ventec’s Mark Goodwin and Didier Mauve. In this conversation, Mark and Didier discuss Ventec’s work to curate their product offerings into functional categories based on function and target application. The pair also share their thinking on markets which they see as driving material development work. When material performance becomes an integral part of the PCB’s performance specifications, the traditional way of categorizing materials may not do the job.
02/27/2023 |
Pete Starkey, I-Connect007
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.