Reading time ( words)
During a demonstration, Japan's Maritime Self-Defense Force successfully intercepted short and medium-range ballistic missile targets with SM-3 Block IB and SM-3 Block IIA interceptors. This is the first time a non-U.S. maritime service intercepted targets with both variants of interceptors and it is the first time a Japanese ship fired SM-3 Block IIA. The demonstration was conducted in partnership with the U.S. Missile Defense Agency. Both types of interceptors are made by Raytheon Missiles & Defense, a Raytheon Technologies (NYSE: RTX) business.
"This demonstration reinforces that partners now have greater capability with the Standard Missile family of interceptors," said Tay Fitzgerald, president of Strategic Missile Defense at Raytheon Missiles & Defense. "Allies who use SM-3 can now cooperate more fully with the United States on ballistic missile defense missions."
The multi-day Japan Flight Test Aegis Weapon System-07 included engagements of ballistic missile targets with SM-3 and a next-generation subsonic aerial target with SM-2 Block IIIB.
In support of the U.S.-Japan SM-3 Block IIA Cooperative Development (SCD) Project, Japanese industry and Raytheon Missiles & Defense cooperatively designed and built the SM- 3 Block IIA variant, the world's most advanced sea-land ballistic missile defense interceptor.
In contrast to earlier SM-3 versions, Block IIA's larger rocket motors and increased kill vehicle capabilities allow for significantly greater range and performance against advanced missile threats.
Share
Suggested Items
02/14/2023 |
Nolan Johnson, I-Connect007
House Resolution 7677 from the 2021/22 Congressional session may have run out of time before the election cycle, but that hasn’t ended the effort to help fund the printed circuit board industry alongside the semiconductor industry. IPC vice president of global government relations, Chris Mitchell, shared this letter, sent to DOD on Wednesday by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), which insists DOD must “leverage all available resources, including the use of Title III of the Defense Production Act (DPA), to increase domestic production of PCBs and IC substrates.”
12/29/2021 |
Georgia Tech
Department of Defense grant enables collaboration with Spelman College, Technical College System of Georgia, and the Georgia Department of Economic Development in pilot project
12/13/2021 |
Chris Peters, USPAE
Like a cancer that spreads untreated until it becomes an urgent problem, the U.S. defense community is facing a small but growing problem that is increasingly undermining U.S. military readiness and technological dominance. The problem is lead—specifically, the lead-alloy solders that traditionally have been used to attach electronic components to printed circuit boards (PCBs). Over the last 15 years, the commercial electronics industry has shifted to lead-free solders, prompted by environmental health regulations in Europe and elsewhere. However, the U.S. Department of Defense (DoD) and its contractors never made the switch and are still heavily reliant on leaded solders. Now, leaded electronics are becoming harder to find and more outdated.
