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The 2014 International Wafer-Level Packaging Conference to be held this week, from November 11-13, in San Jose, California, will also feature application-oriented tutorials that are structured to combine field experience with scientific research to solve everyday problems.
The tutorials are offered on November 13, and will feature the below topics:
- Wafer Level Packaging for MEMS and Microsystems -- Challenges and Opportunities (To be presented by Leland "Chip" Spangler, Ph.D., Aspen Microsystems, LLC).
- Wafer Level-Chip Scale Packaging (WL-CSP) (To be presented by Luu Nguyen, Ph.D., Texas Instruments).
- 3D IC Integration and Packaging (To be presented by John H. Lau, Ph.D., ASM Pacific Technology).
- Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration (To be presented by Ning-Cheng Lee, Ph.D, Indium Corporation).