Reading time ( words)
Signal integrity engineers and EMC engineers look at the decoupling capacitor in different ways. This award-winning paper presented at DesignCon 2007 looks at decoupling from a time-domain and a frequency-domain viewpoint. Click here to read this paper, authored by James L. Drewniak, University of Missouri-Rolla;
Bruce Archambeault, IBM; James Knighten, NCR; Giuseppe Selli, University of Missouri -Rolla; Jun Fan, NCR; Matteo Cocchini, University of Missouri-Rolla; Samuel Connor, IBM; and Liang Xue, National Semiconductor.
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Andy Shaughnessy, PCB Design007
At PCB West, Zuken shared a booth with Nano Dimension. Zuken has been working with Nano Dimension for some time, and adding support for 3D printing and nanotechnology to its design tool platforms. I sat down with Zuken’s Humair Mandavia and Nano Dimension’s Simon Fried to learn more about this alliance, and to find out more about this odd-looking box being demonstrated in Zuken’s booth.
Pete Starkey, I-Connect007
European Editor Pete Starkey and Ucamco Managing Director Karel Tavernier discuss Ucamco’s cloud-based Communic8tor platform which facilitates two-way communication between the CAM engineer and the PCB designer, or any other party involved in the manufacturing process. This gives real-time access to image data and annotations, enabling queries to be resolved, changes to be approved, and a full communications history to be maintained.
The I-Connect007 Team
When we began planning the October issue on signal integrity, we arranged a conference call with a variety of industry experts. Mike Steinberger of SiSoft, Mark Thompson of Prototron Circuits, and Yogen and Sunny Patel of Candor Industries joined editors Andy Shaughnessy, Patty Goldman, Happy Holden and Publisher Barry Matties on the call for a spirited discussion about the challenges related to signal integrity and some of the tricks of the trade for helping ensure SI.