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P. KAY Metal has announced the issuance of a new expansion of its MS2 solder dross elimination patent in Mexico (patent #321779). This is the second patent covering solder dross elimination and solder recovery granted for this product and even more important, process in Mexico. The use of liquid dross recovery materials in an off-line process has been added to the claims which now exactly duplicate the previously granted U.S. patent.
Jay Hardin, product manager for the MS2 product line, stated, “Using MS2 in an offline controlled process allows our customers to recover up to 90% of the useable solder directly from the solder dross into useable solder bars and to do it off line away from the wave soldering process.”
For information contact Dan Feinberg or Jay Hardin or call (323) 585-5058.
Patty Goldman, I-Connect007
There is no denying that high-density interconnect (HDI) has been around a long time—over 25 years, believe it or not. From almost the moment of its conception in the U.S., the technology was adopted by and used almost exclusively in Asia.
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Andreas Lydersen, ELMATICA
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