Another Look at AOI


Reading time ( words)

PCB inspection is taking on greater significance as boards and packaging become increasingly smaller, with greater functionality. Automated optical inspection (AOI) and its backup associate, X-ray, team up to catch a variety of board assembly problems. But it’s AOI that’s at the forefront of this process.

AOI takes on a variety of key assignments, such as checking out the numbers labeled on passive and active devices and matching them with the database to assure they’re legitimate components, as specified in the bill of materials (BOM). Also, if alternate parts are used, the AOI machine is trained to verify them, regardless of manufacturer, as long as the device has the same footprint, value, tolerance, voltage, package type, etc.

That’s only the beginning. AOI is excellent at detecting missing or wrong components and misalignments. If a component is misaligned, say at 30° or 45°, AOI catches it. It also catches opens and bridging, and it can check for skewed parts and tombstoning. AOI can detect anything as long as it’s written on the component.

Read the full column here.


Editor's Note: This column originally appeared in the October 2013 issue of SMT Magazine.

Share


Suggested Items

Taking an Independent Path: Strategies for Low Risk Sourcing of Components in a Constrained Market

10/24/2018 | Jeff Elliott
Today, the challenges of a highly stressed supply chain are forcing many OEMs and EMS providers to rethink the way they source components. With parts such as multilayer ceramic capacitors (MLCCs) and other low-cost components in chronic shortage with extended lead times for delivery, manufacturers must be able to get these parts on-time at the lowest possible cost without assuming additional risk.

What SMT Component Shortages Mean for Design and Manufacturing Engineers

09/13/2018 | Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.



Copyright © 2018 I-Connect007. All rights reserved.