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Headlines of the Week

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1. JAIST (Technical institute in Japan) 2/14
The organization has developed the world's most heat resistant plastic with high transparency through a bio-chemical process. It withstands temperatures of up to 390 degrees C.

2. USHIO (Major lighting equipment supplier in Japan) 2/17
The supplier has developed the world's first parallel VUV light source unit for high-resolution direct imaging equipment used with flexible electronics.

3. Yamagata University (Japan) 2/18
The university has co-developed the world's first flexible organic semiconductor via a printing process with Ube Industries.

4. NEC SCHOTT Components (Device manufacturer in Japan) 2/25
The manufacturer has unveiled a new packaging technology, “GTAS,” for lithium ion batteries.

5. Hitachi Chemical (Major electronics material supplier in Japan) 3/3
The supplier has created a new joint venture for epoxy resin molding with Hitachi and Sumitomo Electric.

6. Konica Minolta (Major optical device manufacturer in Japan) 3/4
The manufacturer has developed a white organic EL lighting panel featuring the world's highest efficiency of 131 lm/W.

7. Kyocera (Major electronics company in Japan) 3/3
The company has commercialized a new 0.5-mm pitch ZIF FFC connector 6808 Series capable for use with power lines of high-density flex circuits.  

8. AIST (R&D organization in Japan) 3/4
The organization has co-developed a mono-layer carbon nanotube via a printing process. It could be valuable as an electrode material of various batteries.

9. SPIL (Major packaging firm in Taiwan) 3/5
February shipments of NT $5.574 billion declined 7.5% from the previous month, but increased 31.1% from the same month of the previous year.

10. Mitsubishi Materials (Major material supplier in Japan) 3/10
The supplier has developed the world's thinnest bendable thermistor sensor built on 50 micron thick polyimide film. Total thickness can be thinner than 70 microns.

11. MURATA (Major device manufacturer in Japan) 3/11
The manufacturer has developed the world's first SMT-type ultrasound sensor for mobile applications. Size: 5.2 x 5.2 x 1.15 mm; sensitivity: 100dB.

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