NPL/SMART Group Conformal Coating & Cleaning Experience


Reading time ( words)

By far the best-attended seminar-workshop event at an excellent National Electronics Week (NEW) show was the NPL/SMART Group Conformal Coating and Cleaning Experience, seamlessly organised, coordinated, and managed by SMART Group Technical Director and showman extraordinaire Bob Willis.

Day One

Willis combined the exhibition and demonstration area with the seminar theatre to offer an integrated learning experience dedicated to cleaning and coating. The area was a bustle of activity for the three days of the show, several visitors having travelled from mainland Europe and Eastern Europe with attendance at this NPL/SMART event as their primary objective, and several UK assemblers I spoke to were looking to gain a clear understanding of the technology and available options before embarking upon in-house conformal coating.

An hourly series of short, punchy presentations from industry experts, interspersed with opportunities to ask questions and to see equipment and materials in real-time action, maintained a consistent momentum. In Willis' words: “It’s about getting them interested to start with!”

Getting people interested in design considerations was a task expertly undertaken by David Greenman from Humiseal. Appropriate and adequate conformal coating drawings were rarely provided, and conformal coatings were commonly specified for historical reasons rather than properly selected to suit the anticipated operating environment. It was important to check the compatibility of a coating with the components of the assembly, and particularly to determine the wettability of the solder mask to ensure good adhesion. “No clean is no option” was his comment about surface cleanliness prior to coating and he recommended SIR testing as a means of qualifying the complete assembly process.

Share


Suggested Items

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

11/17/2017 | I-Connect007
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Solder Preforms 101: Ask the Expert

11/13/2017 | Patty Goldman, I-Connect007
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.



Copyright © 2017 I-Connect007. All rights reserved.