Bob Willis Webinar: Laser, Robotic Iron Soldering


Reading time ( words)

Over the past few years, there has been a lot of discussion on the need for higher temperature materials and expanding the use and knowledge of high-temperature assembly techniques.

In many industries, there is also increasing interest in automating these soldering processes rather than the traditional manual soldering techniques for small- and medium-volume assembly. But when we start to talk about high-temperature electronics it is not just the solder alloy, but all the materials that are used to produce an electronic assembly. Substrates, components, connectors, cables, and solder need to be examined; the needs of the assembly process also require careful consideration.

Often due to the smaller volumes many companies who require high-temperature capability have used manual soldering techniques, particularly for through-hole. Typically, the industries affected by these hostile working conditions include, aerospace, automotive, petrochemical, and military.

Laser soldering and robotic iron systems are increasingly being investigated for use in factories and due to the limited availability of information NPL has started looking at the benefits of these techniques.

In line with this, Bob Willis will conduct a webinar, "Laser & Robotic Iron Soldering for Electronics Assembly," January 19 to discuss issues such as the reasons for laser and robotic soldering, equipment considerations, soldering with high-temperature solder alloys, intermetallic formation, impact of ageing, inspection of solder joints, and common process defects.

For more information, click here.

Share


Suggested Items

Plasmatreat on Atmospheric Pressure Plasma

07/20/2018 | Barry Matties, I-Connect007
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.

Tackling Reliability Challenges in Low-Temperature Soldering

07/18/2018 | Barry Matties and Stephen Las Marias, I-Connect007
William Yu, senior technical services manager for Alpha Assembly Solutions, recently shared with I-Connect007 the challenges when it comes to the reliability of low-temperature solder pastes, and soldering strategies to overcome these issues.

Conversation with Miraco… Strategies for Successful Flex Circuit Assembly

07/11/2018 | Stephen Las Marias, I-Connect007
Jason Michaud, a 19-year veteran at Miraco Inc., is the company’s new vice president of sales. In an interview with SMT007 Magazine, Jason speaks about the factors driving the increasing utilization of flexible printed circuits, the challenges in flex circuit assembly, and the best practices to address those issues.



Copyright © 2018 I-Connect007. All rights reserved.