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On Tuesday, January 13, 2015, the House of Representatives passed H.R. 185, the Regulatory Accountability Act. This bi-partisan bill is designed to curb costly regulations that negatively impact electronics companies’ ability to compete in a global marketplace.
IPC, along with other industry groups, signed a letter in support of the bill. This letter was essential during the floor debate as House Judiciary Committee Chairman Bob Goodlatte (R-Va.), a sponsor of the bill, referenced the letter to show the bill’s broad support.
IPC has supported this bill through its House passage in 2013, 2014 and now, 2015. This legislative effort was one of the issues discussed during IPC’s advocacy event, IMPACT 2014, last June.
IPC will be working in the months ahead to make sure our industry’s voice is heard as this bill progresses and hopefully gets taken up by the Senate.
You can read more about the bill and how it will modernize the federal rulemaking process here.
Richard Heimsch, SUPER DRY
Research by SMT & Hybrid GmbH (now SMT Elektronik) was conducted just prior to the original publication of IPC-1601, which now provides detailed guidelines for the packaging and storage of PCBs, both from the PCB manufacturer and at the assembler’s manufacturing floor.
Pete Starkey, I-Connect007
The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.
Patty Goldman, I-Connect007
I-Connect007's Patty Goldman has known DIVSYS’ Stan Bentley for many years, having met when the company was called Diversified Systems and they made circuit boards and finished products at their facility in Indianapolis. They saw each other at IMPACT recently, and of course had to have a chat.