Industry Applauds Passing of Regulatory Reform Bill


Reading time ( words)

On Tuesday, January 13, 2015, the House of Representatives passed H.R. 185, the Regulatory Accountability Act. This bi-partisan bill is designed to curb costly regulations that negatively impact electronics companies’ ability to compete in a global marketplace.

IPC, along with other industry groups, signed a letter in support of the bill. This letter was essential during the floor debate as House Judiciary Committee Chairman Bob Goodlatte (R-Va.), a sponsor of the bill, referenced the letter to show the bill’s broad support.

IPC has supported this bill through its House passage in 2013, 2014 and now, 2015. This legislative effort was one of the issues discussed during IPC’s advocacy event, IMPACT 2014, last June.

IPC will be working in the months ahead to make sure our industry’s voice is heard as this bill progresses and hopefully gets taken up by the Senate.

You can read more about the bill and how it will modernize the federal rulemaking process here.

Share


Suggested Items

HDI: Born in the USA and Making a Comeback

11/22/2017 | Patty Goldman, I-Connect007
There is no denying that high-density interconnect (HDI) has been around a long time—over 25 years, believe it or not. From almost the moment of its conception in the U.S., the technology was adopted by and used almost exclusively in Asia.

The PCB Norsemen: Industry 4.0, AI and CircuitData

11/14/2017 | Andreas Lydersen, ELMATICA
As automation works its way onto the shop floors, it still struggles to replace humans in the supporting roles, such as designers, purchasers, brokers, and back-office staff. Where automation on the shop floor replaces humans in doing repetitive manual tasks, the supporting roles (at least some of them) require intelligence to understand and utilise information.

Groundbreaking Developments at liloTree

11/09/2017 | Patty Goldman, I-Connect007
I was introduced to liloTree and Chief Scientist Kunal Shah by Joe Fjelstad. It seems this small company (with Intel as part of its pedigree) has developed a novel ENIG process that just may shake up the regular chemistry suppliers. This new process is described as cost-effective and ecofriendly while completely eliminating black pad and brittle solder joints.



Copyright © 2017 I-Connect007. All rights reserved.