Insulectro Features New PCB, PE Materials at APEX

Reading time ( words)

Insulectro, a leading supplier of materials for use in the printed circuit board industry, plans to roll-out several new products for both the PCB materials market and for the Printed Electronics market at this year’s IPC APEX EXPO at the San Diego Convention Center, February 24 through 26, 2015.

Insulectro Vice President of Product Management Jason Marsh commented, “Changes are coming to the PCB industry at an ever-increasing pace. Circuit boards are continuing the relentless trend towards thinner, smaller, and faster. OEM designers are demanding a new breed of materials with lower loss and lower Dk to design and build boards that were never before possible. As a materials supplier, we are very pleased to be able to introduce a host of exciting products to the electronics industry during IPC’s 2015 tradeshow. We will highlight innovative new products from DuPont®, Isola, LCOA®, Ormet, and Pacothane.”

Marsh added, “We excited to be bringing new high performance products in the High Speed Digital and RF Microwave laminate landscape and well as in the thin dielectric films and sintering paste arenas to facilitate next generation designs.  We also anticipate a lot of interest from fabricators around breakthrough solutions to challenges in backdrilling, conformal backup, high aspect ratio drilling, imaging, and even new additive solutions in our printed electronics portfolio – to name a few.”

“To introduce these and other products to IPC attendees, we will again feature (in Booth 2033) our successful 13.5-minute PowerChats™ where you can get an in-depth presentation of a variety of topics in a very short period of time.”

Kevin Miller, Vice President of Sales for Insulectro’s Printed Electronics initiatives commented, “We have taken an arcade-style approach to our booth at IPC APEX. There are Power Chats, Product Demonstrations, and exciting new hands-on technologies like printed antennas that will amaze attendees. There will always be something going on.

“We invite everyone to drop by and see what’s new,” Miller added. “Although IPC APEX is primarily for the PCB market, we know many of our customers are curious about Printed Electronics. We wanted our guests to get acquainted with these new products, to see them, to understand their benefits, and how they might be game changers for their businesses.”

Insulectro will provide a schedule of product demonstrations and presentations in booth 2033 during the hours the exhibit floor is open on February 24, 25, and 26.

Insulectro will unveil a new PumaFast “Quick Turn” delivery van slated for use in its Silicon Valley branch operation. Marsh commented. “Customers need tomorrow’s solutions today. They can’t wait. We are putting a lot of emphasis on product and service innovation this year. We take innovation very seriously. Our new Puma Fast Quick Turn vehicle will help ensure Insulectro materials reach our customers when they need it.”

 “One of our core values is our commitment to trusted customer and supplier partnerships.  We know the challenges our customers face in a rapidly evolving marketplace and one of our goals is to bring them products that strengthen their businesses,” Kevin Miller concluded.

About Insulectro

Insulectro ( is the leading supplier of PCB and Printed Electronics materials, used to manufacture circuit boards. Insulectro combines its premier product offering with local inventory in strategic stocking locations across the country, fabrication capabilities and backed up by expert customer and technical support services.

Insulectro supplies advanced engineered materials manufactured by DuPont®, Isola, LCOA®, CAC, Inc., Integral Technology, Pacothane, Circuit Foil, and Focus Tech. These products are used by our customers to fabricate complex, multilayer circuit boards. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards, and printed electronics, for applications in a variety of end markets including telecom, data communications, high speed computing, mobile devices, military, and medical.


Suggested Items

HDI: Born in the USA and Making a Comeback

11/22/2017 | Patty Goldman, I-Connect007
There is no denying that high-density interconnect (HDI) has been around a long time—over 25 years, believe it or not. From almost the moment of its conception in the U.S., the technology was adopted by and used almost exclusively in Asia.

Walt Custer’s Annual Update from productronica 2017

11/21/2017 | Patty Goldman, I-Connect007
Industry consultant Walt Custer of Custer Consulting sat down with me at productronica 2017 to once again inform our readers with his yearly update and perspective on what’s happening in the industry. And guess what? It’s good news! Pertinent charts referenced in our conversation are included, but if you want more, Walt invites you to click the link at the end of this conversation and email him directly.

3D Printed Electronics for Printed Circuit Structures

10/04/2017 | Samuel LeBlanc, Paul Deffenbaugh, Jacob Denkins, and Kenneth Church nSCRYPT INC.
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is one of the enabling factors for roll-to-roll processes.

Copyright © 2017 I-Connect007. All rights reserved.