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Al Wasserzug, SR Business Development Exec at Cirexx talks about their new product, Eclisp. Developed in conjunction with Lockheed Martin, Eclisp is an alternative to co-fired ceramics and used to evacuate heat very efficiently with a low CTE. Wasserzug gave a paper on the new technology at IPC APEX EXPO.
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I-Connect007 Editorial Team
During the Design Forum at IPC APEX EXPO 2018, Jan Pedersen, senior technical advisor for the PCB broker Elmatica, gave a presentation on CircuitData. The language is designed to help facilitate other design data transfer formats such as Gerber, ODB++, and IPC-2581. Jan spoke with Managing Editor Andy Shaughnessy and Contributing Technical Editor Happy Holden about how this open language works with the existing data formats, as well as the need to eliminate paper documents from design process, and how the industry can help shape this open-source language.
Andy Shaughnessy, Design007 Magazine
During DesignCon 2018, Andy Shaughnessy sat down for an interview with Martin Cotton, director of OEM projects for Ventec. Martin was a PCB designer for years, so he has experience on both sides of the desk. They discussed Ventec’s reasons for coming to DesignCon, their expansion into low-loss materials, and Ventec’s new I-Connect007 book, The Printed Circuit Designer’s Guide to Thermal Management with Insulated Metal Substrates.
Real Time with...IPC
During IPC APEX EXPO 2018, the IPC-2581 Consortium held a demo of this open-source data transfer standard, attracting numerous designers, fabricators and assembly providers. Jim Pierce of Axiom Electronics and Bob Miklosey of Aegis Software sat down to discuss the demo and their involvement with the consortium. Axiom now charges more for designs submitted in the Gerber format.