EPTAC Updates Popular IPC Certification Mobile App


Reading time ( words)

EPTAC Corporation announced that it has released an update to its popular IPC Certification mobile app on both Apple iOS devices and Google Android phones.

Initially released over a year ago, this popular app allows the user to locate and register for IPC Certification classes throughout the United States and Canada. With over thirty programs to choose from, users can locate a class near them, review the class details, locate a date and time that meets with their schedule and register with EPTAC for the class of their choosing all within one simple app.

The new updates include development on the latest Titanium platform supporting 64-bit, Apple’s iOS 8 and Google’s Lollipop – Android 5. With increased performance and load times, easy navigation enhancements and additional filtering options for selecting the exact program to meet your requirements, the new update provides an improved user experience while providing access to over a thousand classes being delivered throughout North America.

“We have been very excited to see the ever increasing number of people downloading our app.” commented Mark Pilkington, President of EPTAC. “With more features to come, our focus has been on a simple graphic design that allows the user to quickly and easily access the best class options in a timely manner and act on that information.”

EPTAC, the most internationally recognized leader in solder training and IPC certification, gives professionals the skills to accelerate their careers and businesses the talent to succeed in this ever-competitive industry. For over 25 years, EPTAC has been helping companies increase quality standards, improve productivity and maximize profits. Headquartered in Manchester, NH, EPTAC delivers the industry best training programs throughout established locations in the United States and Canada.

Share


Suggested Items

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.

Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications

04/16/2018 | Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.

Why AOI is a Must-have for PCB Assembly

04/05/2018 | Russell Poppe, JJS Manufacturing
AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.




Copyright © 2018 I-Connect007. All rights reserved.