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Guest Editor Dick Crowe and Nick Koop, Senior Application Engineer at TTM Technologies, discuss the latest revision of the flex/rigid-flex standard that is underway. The flex/rigid-flex circuit industry is booming and in many cases North America is the preferred area for manufacture. Nick also encourages those with an interest to participate in IPC subcommittee activities. Not only can your company's voice be heard, but it is a great learning experience.
Patty Goldman, I-Connect007
Every year IPC presents dozens of awards to committee members for their work completing standards and specifications and for other activities within the organization. However, a few awards are extra special and presented for extraordinary efforts, for long-time commitment to both IPC and the electronics industry.
On the last morning of IPC APEX EXPO 2018, we met with Nancy Jaster, IPC design programs manager and one of the driving forces behind IPC’s STEM Outreach program for high school students. We spoke about the students who were arriving on site at IPC APEX EXPO, and what the industry, and IPC, hoped to achieve with this valuable program.
Barry Matties, I-Connect007
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.