Mentor Paper: 10 Tips for Streamlining PCB Thermal Design


Reading time ( words)

Many aspects of a PCB’s performance are determined during detailed design, e.g., making a trace a specific length for timing reasons. Timing issues are also affected by temperature differences between components. Thermal issues with the PCB design are largely locked in during the component (i.e., chip package) selection and layout phases.

After this point only remedial actions are possible if components are found to run too hot. We advocate a top-down approach starting at the system or enclosure level in order to understand the flow environment for the electronics, which is critical for air-cooled electronics. Assumptions made about the uniformity of the airflow in early design that subsequently proves unachievable can have a disastrous impact on the commercial viability of the product and meeting the market window.

This handy “how to” guide provides an overview of the key considerations in PCB thermal design and how to optimize the thermal layout.

To download this white paper, click here.

Share

Print


Suggested Items

This Month in Design007 Magazine: Thermal Fundamentals With Mike Jouppi

09/09/2020 | I-Connect007 Editorial Team
The I-Connect007 team recently interviewed Mike Jouppi, one of the champions of thermal management in PCBs. Mike spent decades working on updating the old IPC current-carrying data, which dated back to the 1950s, and he is the primary architect behind IPC-2152— the standard for determining current-carrying capacity in printed board design. As Mike explained in this wide-ranging interview, even if you’re using the latest thermal design software, you still need to have a firm understanding of the fundamentals.

Just Ask Joe: Standardized Grid Designs

08/26/2020 | I-Connect007 Research Team
First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”

Chris Hanson: New Ventec IMS Dielectrics Rated for Higher Temps

07/07/2020 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy recently spoke with Chris Hanson, global head of IMS Technology for Ventec International Group. During their conversation, Chris discusses his group’s recent efforts to create new IMS materials, with a focus on dielectrics. As Chris explains, Ventec has developed several new dielectrics that can withstand much higher operating temperatures, one of which is UL-rated for a maximum operating temp of 155°C, which may be the highest for an IMS dielectric.



Copyright © 2020 I-Connect007. All rights reserved.