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Many aspects of a PCB’s performance are determined during detailed design, e.g., making a trace a specific length for timing reasons. Timing issues are also affected by temperature differences between components. Thermal issues with the PCB design are largely locked in during the component (i.e., chip package) selection and layout phases.
After this point only remedial actions are possible if components are found to run too hot. We advocate a top-down approach starting at the system or enclosure level in order to understand the flow environment for the electronics, which is critical for air-cooled electronics. Assumptions made about the uniformity of the airflow in early design that subsequently proves unachievable can have a disastrous impact on the commercial viability of the product and meeting the market window.
This handy “how to” guide provides an overview of the key considerations in PCB thermal design and how to optimize the thermal layout.
To download this white paper, click here.
The Electronic System Design Alliance, a SEMI Strategic Association Partner, today hosted the first meeting of the Advisory Council of ES Design West co-located with SEMICON West 2019 West at San Francisco’s Moscone Center, July 9-11, 2019.
Barry Matties, Publisher, I-Connect007
Simon Fried, president of Nano Dimension, discusses how the company has taken the additive manufacturing process to the next level through printed electronics. He also shares his thoughts on the growing demand for 3D circuits, as well as how this could potentially be a game-changer for PCB designers.
Pete Starkey, I-Connect007
After an extreme summer heat wave had left trees dehydrated and struggling to morph into their customary display of reds and golds, the leaves were brown and brittle as the great and good of the UK printed circuit board industry crossed the bridge from the mainland of the south coast of England to Hayling Island for the autumn seminar of the Institute of Circuit Technology on September 20, 2018.