Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts


Reading time ( words)

At IPC APEX EXPO 2015, I caught up with EIPC’s Michael Weinhold and Alun Morgan for a discussion on both recent and ongoing focuses for EIPC, and the importance of the alignment of global standardization processes, especially for Asia.

Pete Starkey: I'm here with two gentlemen from the European Institute of Printed Circuits Technical Director Michael Weinhold, and Chairman Alun Morgan.

Alun, can you get us started by describing the successes of recent times since you joined EIPC? You had a conference recently. What was the outcome of the conference?

Alun Morgan: Yes, we had a very successful conference in Munich at the beginning of February. In fact, that marks the fifth event that we've had this year, so we've carried out four workshops and one conference in the space of the first, say, five weeks of the year. That’s pretty encouraging. The conference was in Munich. We attracted nearly 90 delegates from 11 different countries to attend. We usually find the conferences work very well when we have a good agenda, which means we have good technical presentations. We have an accessible venue, which Munich certainly was. And third we have a good attraction. We were able to organize a visit to the Eurofighter production line in Manching, courtesy of Airbus Defence and Space, which I was very pleased they agreed to. I think those three things came together and gave us a very exciting conference.alun_morgan_interview.png

Highlights include a session on reliability, which was very well reviewed and commented upon, and we will certainly run a road show of workshops on reliability. So we'll bring together some of the key speakers from the events and we'll run those out into the next few months where we hope to attract a lot of interest.

The other item we covered in some detail was signal integrity, which is becoming more and more important in many applications. We had a very nice overview of that, including an aspect from a chemical supplier, who has proposed a new treatment for the oxide side of copper. We know very well what the profile of copper does to signal integrity. Then we got another view that we haven't really had in the last couple of years that really made it nice and rounded. So now we have a very nice view from the people like Polar Instruments, who provide the test equipment, from the board shops, the fabricators, from chemistry supplies and for laminate suppliers.

All in all, a great package that we can also road show as a training workshop. So I think we'll certainly roll that out in the next few months. We're looking forward now to SMT in May which will be in Nuremberg, where again I've been invited to deliver a keynote speech in the PCB forum. And then our next conference in June will be in Berlin.

Starkey: May I ask you what will be the topic of your keynote speech?

Share


Suggested Items

The Institute of Circuit Technology Annual Symposium 2018

06/18/2018 | Pete Starkey, I-Connect007
ICT technical director Bill Wilkie is well-known for choosing notable venues for Institute of Circuit Technology events, and his choice for this year’s Annual Symposium was the National Motor Museum, located in the village of Beaulieu in the heart of the New Forest, a national park in the county of Hampshire in Southern England. The region is known for its heathland, forest trails and native ponies.

Golden Anniversary for EIPC at the 2018 Summer Conference

06/11/2018 | Barry Matties, I-Connect007
June marks the start of summer, and with that, the EIPC’s annual summer conference. Highlighted by its thought-provoking presentations, social outings and factory tours, the conference continues to be valuable and productive for attendees. This year should prove no different, with EIPC set to celebrate its 50th anniversary. I spoke with EIPC Executive Director Kirsten Smit-Westenberg about what can be expected from the upcoming conference in Düsseldorf, Germany.

Experts Discussion: The Flex Technologists Speak

06/05/2018 | I-Connect007 Editorial Team
For our first issue of the Flex007 Magazine, we invited a group of flexible circuit experts to discuss their work in this rapidly growing segment. Participants included Jonathan Weldon of DuPont, Mark Finstad of Flexible Circuit Technologies, and Scott McCurdy and Scott Miller of Freedom CAD. In a free-wheeling discussion with Andy Shaughnessy and Barry Matties, these technologists share their thoughts on the challenges and opportunities in flexible circuits, as well as what constitutes the cutting edge of flex right now.




Copyright © 2018 I-Connect007. All rights reserved.