Japan’s Thermosetting Plastics Association Represents at IPC APEX EXPO 2015


Reading time ( words)

At the International Reception, held opening night of IPC APEX EXPO 2015, I-Connect Technical Editor Pete Starkey made the rounds and found some visitors from Japan, namely, Kazutaka Masaoka, from Thermosetting Plastics Association (JTPIA). In this brief interview conducted amongst the reception attendees, Masaoka-san and Starkey discuss Japanese vs. North American circuit board quality and business trends.

Pete Starkey: Masaoka-san, it's a pleasure to meet you here.

Kazutaka Masaoka: Nice to meet you.

Starkey: Could you give me what brings you to San Diego for IPC APEX EXPO, and also some idea of your first impressions?

Masaoka: Yes, thank you. Originally, I'm from Hitachi Chemical. I was 60 years old when I retired, and then I moved to the Association. Before that, I worked in R&D, on the development of dry film photoresist—for a long time.  So I've been interested in this kind of exhibition for many years, and I’ve enjoyed seeing the technical trends moving and changing year by year, generation by generation. For example, at the start of developing my product, the focus was how many lines can fit between through-holes? When I started to work, in terms of that, it was just two lines between through-holes, but the technology today is changing so much. It’s very impressive.

Starkey:  We have always looked to Japan for the leading edge in technology. How do you see the comparison between the technical capability now in Japan and the technical capability now in North America?

Masaoka: Basically, previous circuit boards in the West were based on the military application. They were known for their polymer substrate, and you know that type of substrate has to have high temperature resistance and be of very high quality. But at that moment, 20 or 30 years ago, the U.S. technology level was very high, and our Japanese quality of the previous circuit board not. Since then, the Japanese people have made a lot of effort to improve the capabilities of their circuit boards. But the U.S. is moving as well, and changing and developing year by year. So perhaps quality of the previous Japanese circuit board is very close to yours, but still competing. I think we need to have some impact or stimulation from technology or market or people.

Starkey:  So what would you say is your main purpose coming here to this convention?

Masaoka: To look at the typical trends and observe the markets.

Starkey: Masaoka-san, thanks for your time and best of luck this week.

Masaoka: Thank you.

Share


Suggested Items

Improving Design, Manufacturing and Assembly Teamwork

01/15/2018 | Syrma Technology
Many electronics manufacturers tend to compartmentalize or "silo" their departments, such as the design team versus assembly-related functions. The relationship between design and manufacturing can too often be disconnected or otherwise poor, which stalls productivity and increases bottom-line costs. By identifying and addressing these gaps, this financial hemorrhage can be reduced, and profitability increased.

Recent Innovations in DFMA

01/10/2018 | Syrma Technology
Software, electronics and sensors are making their way into the world of product design. New composites, plastics and alloys are replacing traditional metals. Designs are even reducing the carbon footprint of manufacturers, and more products can be recycled when they reach the end of their use.

Blockchain for Manufacturing: What are the Opportunities?

11/17/2017 | Neil Sharp, JJS Manufacturing
Blockchain is one of the hottest topics in the tech world, and a buzzword that’s been popping up quite a bit over the last year or so. It is said to have the potential to radically simplify many business processes, by reducing risk and boosting transparency. In the manufacturing world, what are its opportunities?



Copyright © 2018 I-Connect007. All rights reserved.