DesignCon 2015 Names Best Paper Awards Winners


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Vectorless Prediction of Simultaneous Switching Noise from FPGAs

  • Chunchun Sui, Ph.D Candidate, Missouri University of Science and Technology

Optimization of PCB Capacitors for Signal Integrity Performance in Mixed Reference Channels

  • Gerardo Romo Luevano, Staff Engineer/Manager, Qualcomm Technology Inc.
  • Martin Schauer, Principal Engineer, CST of America
  • Darryl Kostka, Senior Application Engineer, CST of America
  • Selman Ozbayat, Sr. Engineer, Qualcomm Technology Inc.

Test & Measurement

100 Gb/s Ethernet 100GBASE-CR4 Test Points and Test Fixtures

  • Christopher DiMinico, President/CTO, MC Communications
  • Mike Sapozhnikov, Technical Leader, Cisco Systems
  • Mike Resso, Signal Integrity Application Scientist, Keysight Technologies

One-Sided Measurement of Power Supply Impedance without Connectors

  • Joachim Held, EMC Consultant, Siemens AG
  • Richard Sjiariel, Senior Application Engineer, CST

"The winners of this year's Best Paper Awards highlight some of the top talent in semiconductor and electronic design today," said DesignCon Technical Program Director, Janine Love. "This awards program not only recognizes some of the best and brightest, but it also incentivizes researchers to produce high-quality DesignCon papers, ensuring our attendees get the most innovative content at our annual shows. Congratulations to all finalists and winners."

For additional highlights and insights from DesignCon, visit EDN's DesignCon Central: edn.com/designcon.

DesignCon 2016 Call for Papers
Coming off of an incredible show in January, DesignCon is already gearing up for what should be another record-breaking show next year. DesignCon 2016 will take place January 19-22 at the Santa Clara Convention Center in Santa Clara, CA. Call for Papers will open in mid-May, and the deadline for submissions is June 30, 2015. For more information and updates, visit: designcon.com.

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About DesignCon

DesignCon, produced by UBM Tech, is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This four-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: www.designcon.com/santaclara/.

About UBM Canon

UBM Canon is the leading B-to-B event producer, publisher, and digital media company for the world's $3 trillion advanced, technology-based manufacturing industry. Our print and electronic products deliver trusted information to the advanced manufacturing market and leverage our proprietary 1.3 million name database to connect suppliers with buyers and purchase influencers. We produce more than 50 events and conferences in a dozen countries, connecting manufacturing professionals from around the globe. UBM Canon is part of UBM plc (UBM.L) a global provider of media and information services for professional B-to-B communities and markets.

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