Key PCB Makers Strategize to Meet Industry Demands


Reading time ( words)

Research and Markets has announced the addition of the "Global Printed Circuit Boards (PCBs) Market 2015-2020: Trends, Forecasts and Opportunity Analysis" report to their offering. 

The PCBs market is expected to grow with a CAGR of 4% over 2015-2020

The computer/peripheral application is expected to witness the highest growth followed by the communication applications. Nippon Mektron, Zhen Ding Technology Holding Limited, Young Poong Electronics Co., Ltd., Unimicron Technology Corp., and Samsung Electro-Mechanics are among the major suppliers of PCBs. The industry players are going for partnership and strategic alliances to deliver unique solutions and to meet the constantly changing industry demands of customers.

The major drivers of the PCBs market are growing demand for 3C applications (communication, computer/peripheral, and consumer electronics), advancement in PCB technologies, and increased demand of aerospace and defense products. 

Advancement in smart phones, touchscreen tablets, laptops and increasing demand for consumer electronics are expected to drive the PCBs market. 

This report provides an analysis of global PCBs market, including the market trends, growth opportunities, key drivers, emerging trends, and company profiles of the leading suppliers in the market. 

The study also includes forecast of global PCBs market through 2020, segmented by applications, substrate types, regions, together with PCB laminates market by regions, types, and raw materials market, as follows: 

The global PCBs market by application: 
- Communications 
- Consumer Electronics 
- Computer/Peripheral 
- Military/Aerospace 
- Industrial Electronics 
- Automotive and Others 

The global PCBs market by substrate types: 
- Rigid 1-2 sided 
- Standard Multilayers 
- HDI/Microvia/Build-up 
- IC Substrate 
- Flexible Circuits 
- Rigid Flex 
- Others 

The global PCB Laminates market by types: 
- Paper 
- FR-4 
- CEM 
- Polyimide 
- Others 

For more information click here.

Share


Suggested Items

Part 2: EIPC’s Winter Conference in Lyon, France: Day 2 Review

02/21/2018 | Pete Starkey, I-Connect007
The final session, on European needs for new technology, product safety and training, was introduced and moderated by EIPC board member Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group.

EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

02/12/2018 | Pete Starkey, I-Connect007
Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!

The Benefits of Coming Together to Form a Global Reach

01/16/2018 | Patty Goldman, I-Connect007
At productronica, MacDermid Enthone Electronics Solutions and Alpha Assembly Solutions had one large combined booth to promote the companies’ integration. Over a buttered pretzel (don’t knock it until you’ve tried it), we talked about the newly amalgamated company, something everyone in the company is quite enthusiastic about.



Copyright © 2018 I-Connect007. All rights reserved.