Key PCB Makers Strategize to Meet Industry Demands


Reading time ( words)

Research and Markets has announced the addition of the "Global Printed Circuit Boards (PCBs) Market 2015-2020: Trends, Forecasts and Opportunity Analysis" report to their offering. 

The PCBs market is expected to grow with a CAGR of 4% over 2015-2020

The computer/peripheral application is expected to witness the highest growth followed by the communication applications. Nippon Mektron, Zhen Ding Technology Holding Limited, Young Poong Electronics Co., Ltd., Unimicron Technology Corp., and Samsung Electro-Mechanics are among the major suppliers of PCBs. The industry players are going for partnership and strategic alliances to deliver unique solutions and to meet the constantly changing industry demands of customers.

The major drivers of the PCBs market are growing demand for 3C applications (communication, computer/peripheral, and consumer electronics), advancement in PCB technologies, and increased demand of aerospace and defense products. 

Advancement in smart phones, touchscreen tablets, laptops and increasing demand for consumer electronics are expected to drive the PCBs market. 

This report provides an analysis of global PCBs market, including the market trends, growth opportunities, key drivers, emerging trends, and company profiles of the leading suppliers in the market. 

The study also includes forecast of global PCBs market through 2020, segmented by applications, substrate types, regions, together with PCB laminates market by regions, types, and raw materials market, as follows: 

The global PCBs market by application: 
- Communications 
- Consumer Electronics 
- Computer/Peripheral 
- Military/Aerospace 
- Industrial Electronics 
- Automotive and Others 

The global PCBs market by substrate types: 
- Rigid 1-2 sided 
- Standard Multilayers 
- HDI/Microvia/Build-up 
- IC Substrate 
- Flexible Circuits 
- Rigid Flex 
- Others 

The global PCB Laminates market by types: 
- Paper 
- FR-4 
- CEM 
- Polyimide 
- Others 

For more information click here.

Share


Suggested Items

HDI: Born in the USA and Making a Comeback

11/22/2017 | Patty Goldman, I-Connect007
There is no denying that high-density interconnect (HDI) has been around a long time—over 25 years, believe it or not. From almost the moment of its conception in the U.S., the technology was adopted by and used almost exclusively in Asia.

Walt Custer’s Annual Update from productronica 2017

11/21/2017 | Patty Goldman, I-Connect007
Industry consultant Walt Custer of Custer Consulting sat down with me at productronica 2017 to once again inform our readers with his yearly update and perspective on what’s happening in the industry. And guess what? It’s good news! Pertinent charts referenced in our conversation are included, but if you want more, Walt invites you to click the link at the end of this conversation and email him directly.

3D Printed Electronics for Printed Circuit Structures

10/04/2017 | Samuel LeBlanc, Paul Deffenbaugh, Jacob Denkins, and Kenneth Church nSCRYPT INC.
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is one of the enabling factors for roll-to-roll processes.



Copyright © 2017 I-Connect007. All rights reserved.