Mentor Offering Training in Atlanta, Tampa in April


Reading time ( words)

Nearly all PCB designs have signal integrity, power integrity and EMI problems when they are first created. Finding these problems can be a big challenge. Simulation is important but do you simulate all nets? How do you analyze designs for EMI effects? Do you know that your power distribution network will work at DC and over a wide frequency range?

Many companies approach these problems with a difficult process involving design guidelines, experience and many independent reviewers. Visual inspection is also used to identify any issues in layout that may cause problems. This is so time-consuming and error prone that often every check is not done with the same level of quality. Appropriate experts are used to validate electrical issues on the board, and this creates a further bottleneck, slowing the design and development process down even more.

Our agenda will include a description of the “electrical signoff” problem, and an overview of the HyperLynx tools that address the signoff requirements. Several short demos will show how easy-to-use and effective the HyperLynx virtual prototyping tools can be.

What You Will Learn

  • The “electrical signoff” challenge
  • How HyperLynx virtual prototyping solutions can improve the “electrical signoff process”
    • HyperLynx DRC
    • HyperLynx SI
    • HyperLynx PI

When
Norcross, Georgia: April 14, 2015
10 am – 1 pm

Tampa, Florida: April 16, 2015
10 am – 1 pm

To register, click here.

Share


Suggested Items

Dave Wiens Discusses Multi-board Design Techniques

07/09/2018 | Andy Shaughnessy, I-Connect007
For our multi-board design issue, I interviewed Dave Wiens, product marketing manager for Mentor, a Siemens business. We discussed how the multi-board design technique differs from laying out single boards, along with the planning, simulation and analysis processes required to design multi-board systems.

Paving the Way for 400Gb Ethernet and 5G

06/26/2018 | Chang Fei Yee, Keysight Technologies
This article briefly introduces the 4-level pulse amplitude modulation (PAM-4) and its application in 400 Gigabit Ethernet (400GbE), to support the booming data traffic volume in conjunction with the deployment of 5G mobile communications. Furthermore, this article also highlights the essential pre-layout effort from signal integrity perspective for physical (PHY) link design on a PCB, including material selection, transmission line design and channel simulation to support 56Gbps data rate that paves the way for seamless communication in 400GbE.

Excerpt: The Printed Circuit Designer’s Guide to…Flex and Rigid-Flex Fundamentals

06/25/2018 | Dave Lackey and Anaya Vardya, American Standard Circuits
The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.



Copyright © 2018 I-Connect007. All rights reserved.