Global PCB Industry Report 2015


Reading time ( words)

Research and Markets has announced the addition of the "Global Printed Circuit Board Industry Report 2015" report to their offering. 

The Global Printed Circuit Board Industry Report 2015 is a professional and in-depth study on the current state of the printed circuit board industry. 

The report provides a basic overview of the industry including definitions, classifications, applications and industry chain structure. The printed circuit board market analysis is provided for the international markets including development trends, competitive landscape analysis, and key regions development status. 

Development policies and plans are also discussed and manufacturing processes and cost structures analyzed. Printed circuit board industry import/export consumption, supply and demand figures and cost price and production value gross margins are also provided. 

The report focuses on twenty-five industry players providing information such as company profiles, product picture and specification, capacity production, price, cost, production value and contact information. Upstream raw materials and equipment and downstream demand analysis is also carried out. The printed circuit board industry development trends and marketing channels are analyzed. Finally the feasibility of new investment projects are assessed and overall research conclusions offered. 

With 236 tables and figures the report provides key statistics on the state of the industry and is a valuable source of guidance and direction for companies and individuals interested in the market.

Share


Suggested Items

35 Years of HDI Fabrication Processes and Obstacles for Implementation

12/04/2017 | Happy Holden, I-Connect007
The electronics industry is the world’s largest and most robust market. It is also a bulwark of American creativity, with Silicon Valley as its origin and fortress.

HDI’s Beneficial Influence on High-Frequency Signal Integrity

10/17/2017 | Happy Holden, I-Connect007
The increasingly widespread use of finepitch ball-grid array (BGA), chip scale packaging (CSP), and other evolving technology form-factors means that new fabrication techniques must be used to create printed circuit boards (PCBs).

Megasonic Acoustic Surface Treatment Process for Enhanced Copper Electrodeposition in Via Interconnects

07/04/2017 | Thomas Jones, Dr. David Flynn, Marc P.Y. Desmulliez and Dennis Price
A printed circuit board is populated with a multitude of electro-mechanical components plus various active and passive devices such as transistors, capacitors, inductors and resistors, which enable the functionality and assembly of the PCB. Increasing the density of the components on the surface of a board enables greater functionality and use.



Copyright © 2018 I-Connect007. All rights reserved.