Reading time ( words)
New paradigms in consumer buying patterns are putting pressure on PCB manufacturers to become a whole lot more flexible. And although efforts are made to streamline and optimize, the big picture is not changing. The challenge to become more flexible surpasses manufacturing – it requires the whole business process to change. We’ve uncovered some of the most shocking statistics in manufacturing today which, when viewed as part of an overall business process, are mind-blowing.
In this paper, we expose the top five manufacturing statistics that illustrate the most compelling opportunities to drive change in PCB manufacturing.
For more information, click here.
Patty Goldman, I-Connect007
Martin Bunce was one of several people from MacDermid Enthone who presented at SMTA International this year. He sat down with me for a chat about his paper on final finishes, particularly with regard to controlling gold thickness.
Michael Carano, RBP Chemical Technology
Defects may “manifest” or be detected in or after a specific operation within the printed circuit board manufacturing process, but the underlying root cause may have occurred earlier (perhaps much earlier) in the process.
Pete Starkey, I-Connect007
This year’s event had a well-chosen and varied programme featuring presentations on process chemistry and R&D consortia, a discussion of controversial standards proposals and a review of the experiences of commissioning new technology in a start-up factory.