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New paradigms in consumer buying patterns are putting pressure on PCB manufacturers to become a whole lot more flexible. And although efforts are made to streamline and optimize, the big picture is not changing. The challenge to become more flexible surpasses manufacturing – it requires the whole business process to change. We’ve uncovered some of the most shocking statistics in manufacturing today which, when viewed as part of an overall business process, are mind-blowing.
In this paper, we expose the top five manufacturing statistics that illustrate the most compelling opportunities to drive change in PCB manufacturing.
For more information, click here.
Barry Matties, I-Connect007
Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI.
Pete Starkey, I-Connect007
The Institute of Circuit Technology returned to Meriden, traditionally regarded as the centre of England, for its Annual General Meeting, which was followed by a technical seminar of five presentations, introduced as ever by Technical Director Bill Wilkie.
James Hall, CHEMCUT CORPORATION
Congratulations! Your process development team has completed its DOEs and is convinced they are ready to scale up. The facilities crew has found space for your new operation or, even better, your manufacturing team will have a newly-built building in which to locate the project.