Eric Bogatin Teaches S-Parameters for the First Time in Scandinavia


Reading time ( words)

Eric Bogatin helps celebrate 70 years of S-Parameters by giving a rare public class in Copenhagen. S-Parameters are staring to become a required skill for digital design engineers.

S-Parameters were invented 70 years ago in 1945. A way of celebrating this is to learn to actually use S-Parameters for real. For many digital design engineers this is now a required skill. Traditionally S-Parameters have been used mostly by RF and analog design engineers, but as speed increases in digital systems the two sides meet here.

”S-Parameters have become the defacto standard to characterize the electrical properties of interconnects, yet 99% of engineers really have no clue what they mean,” as Eric Bogatin explains. Eric is one of the leading experts teaching S-Parameters as an integral part of signal integrity.

In June, Eric Bogatin will be in Copenhagen to help engineers join the 1% group. The 1% who really understand how to use S-Parameters to solve day to day design problems. “This is our - maybe nerdy - way of celebrating Vitold Belevitch’s invention: The S-Parameters 70 years ago,” explains Rolf Ostergaard of EE-Training.

First course in the Nordic Region

At the course on June 8-9th, engineers can learn this directly from Eric Bogatin in Copenhagen, Denmark. This is the first time in the Nordic and one of the first courses Eric Bogatin is giving after several years of no public training.

The course will give the participants a jump start with the skills to see all the hidden secrets locked within the S-parameter information. Eric Bogatin strips away the complicated math to reveal the essential principles. It’s like opening the lid to the black box and exploring how to data mine the wealth of information you will find within.

While traditionally, S-parameters are about how sine waves interact with an interconnect, this basic formalism is expanded to include the time domain and both single-ended and differential interconnects as well as from measurements and simulations.

Also many consistency tests everyone should perform on all S-parameter data are covered. As always, it’s good to double check on how reasonable the results are.

After this class, all participants will be part of the 1% and never again be intimidated by S-parameters.

About Eric Bogatin

Eric Bogatin is the author of the book Signal and Power Integrity - Simplified. Today he runs Teledyne LeCroy Signal Integrity Academy and is an Adjunct Professor at the University of Colorado - Boulder.

Bogatin received his BS in physics from MIT and MS and PhD in physics from the University of Arizona in Tucson. He has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft and Interconnect Devices. He has written six technical books in the field and presented classes and lectures on signal integrity worldwide.

Read more at www.ee-training.dk

Save €100 when signing up for the course with promotion code “REL756”.

Share


Suggested Items

Excerpt: The Printed Circuit Designer’s Guide to…Flex and Rigid-Flex Fundamentals

06/20/2018 | Dave Lackey and Anaya Vardya, American Standard Circuits
The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.

Faster Board Speeds Demand Constraint-Driven Design

06/19/2018 | Ralf Bruening, Zuken
Using powerful constraint techniques can be a double-edged sword. While the design process is made much safer by including constraints, it is all too easy to over-constrain the design and make it impossible to complete routing and placement. Even paper design guidelines can make products uneconomic to produce unless a great deal of engineering knowledge is applied during the design.

Making the Most of PCB Materials for 5G Microwave and mmWave Amps

06/13/2018 | John Coonrod, Rogers Corporation
Ready or not, 5G is coming, and it will require the right circuit materials for many different types of high-frequency circuits, including power amplifiers. 5G represents the latest and greatest in wireless technology, and it will be challenging to design and fabricate, starting with the circuit board materials, because it will operate across many different frequencies, such as 6 GHz and below, as well as at millimeter-wave frequencies (typically 30 GHz and above).



Copyright © 2018 I-Connect007. All rights reserved.