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These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports.
Printed Board Design
The 1-10b Current Carrying Capacity Task Group met to discuss a replacement methodology for the legacy IPC-TM-650 Method 184.108.40.206, Conductor Temperature Rise Due to Current Changes in Conductors. A Design of Experiments (DOE) was discussed that included where test coupons would be designed, fabricated and tested. A follow-on web conference will be required to determine what types of conductors will be provide on the coupon design, and whether or not flexible circuit materials and various via structures (blind, buried, staggered, etc.) will be employed.
The 1-10c Test Coupon and Artwork Generation Task Group met to establish design parameters for a new “K” test coupon that is a derivate of the AB/R design found in Appendix A of IPC-2221B, Generic Standard on Printed Board Design. This new design is intended to address drill to copper assessment. The task group will also be working on the completion of the AB/R/D Users Guide as a supplement to the IPC-2221B Appendix A in the spring of 2015.
The 1-14 DFX Standards Subcommittee met and continued work on IPC-2231, Design for Excellence (DFX) Guideline During the Product Lifecycle, scheduled for release in 2016. Comments received to date were reviewed by the committee and appropriated into the document as agreed.
Cleaning and Coating
The 5-31g Stencil Cleaning Task Group met to work on IPC-7526, Stencil and Misprinted Board Cleaning Handbook.
The 5-31j Cleaning Compatibility Task Group met to work on test methods and a material compatibility document to replace MIL-STD-202 Method 215. The task group is nearing completion of the draft documents.
The 5-32a Ionic Conductivity Task Group discussed the status of the method detection limit round robin testing and the plan to amend two test methods as a result. They also discussed the need for a test method for localized extraction.
The 5-32b SIR and Electrochemical Migration Task Group met to continue with their work on test methods to support surface mount insulation resistance testing.
The 5-32c Bare Board Cleanliness Assessment Task Group met to review a collection of five test methods within the IPC-TM-650 Test Methods Manual that the group will take ownership of. The objection, in concert with an overall effort to update the IPC-TM-650 Test Methods Manual, will be to review these methods and determine which ones are in need of either revision or reaffirmation as is.
The 5-32e Conductive Anodic Filament (CAF) Task Group discussed how to push the revision B of IPC-9691, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) to as rapid a completion as possible. The task group decided to meet monthly via web conference so the final draft for comments could be in circulation within the CAF group and other interested parties before the IPC meeting in Rosemont IL in late September of 2015.
The 5-33a Conformal Coating Task Group met to work on Revision C of IPC-CC-830, Qualification and Performance of Electrical Insulating Compounds for Printed Wiring Assemblies. The revision will include changes to Moisture and Insulation Resistance (MIR) and the dielectric withstanding voltage (DWV) test methods and test criteria. Two subgroups, 5-33AWG and 5-33AUT also met to work on the test patterns/coupon and ultra-thin coatings, respectively.
The 7-11 Test Methods Subcommittee to review a proposal by IPC to update the many test methods within the IPC-TM-650 Test Methods Manual that are either outdated and no longer applicable within the industry, outdated but still applicable and in need of revision, or lack an applicable IPC standard or guideline that references the method. IPC staff are prepared to launch this project in April 2015 and will work to secure task groups willing to “adopt” a test method and determine its need for archival, revision, or reaffirmation without change.
The 7-12 Microsection Subcommittee announced the acceptance of the Gage R&R Validation Report for the new IPC-TM-650, Method 2.1.1F, Microsectioning, Manual and Semi or Automatic Method, by the IPC 7-11 Test Methods Subcommittee. The revision is a combination of previous versions of IPC-TM-650 Methods 2.1.1 and 220.127.116.11. Method 18.104.22.168 will be cancelled following the release of Method 2.1.1F in the spring of 2015. The subcommittee agreed to then begin discussions on a new methodology that can be used for failure analysis in microsection evaluations.
The 7-23 Assembly Process Effects Handbook Subcommittee addressed problems, probable cause, and actions taken in troubleshooting assembly processes and updated the original IPC process effects handbook, IPC-PE-740, Troubleshooting for Printed Board Manufacture and Assembly, with new information. The group reviewed each of the 15 sections of the draft document and solicited further information/pictures. In addition, subcommittee members requested the document be finalized and released for comment before the fall Standards Meetings in Rosemont, Ill.
The 7-24 Printed Board Process Effects Handbook Subcommittee continued work on the draft for IPC-9121, Troubleshooting for Printed Board Fabrication Processes. The subcommittee plans to have a working draft for subcommittee review in time for comment review at the IPC fall meeting.
The 7-30 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the IPC meetings to be held in September 2015.
The 7-31b IPC-A-610 Task Group met to resolve comments on criteria common to the recently-released F revisions of IPC-A-610, Acceptability for Electronic Assemblies, and IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. IPC is now preparing an amendment for final industry Review.
The 7-31bc Telecom Addendum Task Group met to open the document for revision. The Task Group plans to update the addendum using Revision F of IPC-A-610, Acceptability for Electronic Assemblies as the base document.
The 7-31k Wire Harness Design Task Group and 7-31h IPC-HDBK-620 Handbook Task Group met to complete the draft of a new document for the design of cable and wire harness assemblies. IPC is preparing the document IPC-D-620, Design and Critical Process Requirements for Cable and Wiring Harnesses, for Final Industry Review.