IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,500 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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High Speed/High Frequency
The D-22 High Speed/High Frequency Performance Subcommittee reviewed and approved requirements for copper wrap, employment of filleting/tear drops for lands, and microvia target land structures in the working draft of IPC-6018C, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards. The group also reviewed the requirements for lap shear in section 18.104.22.168 and agreed that this should be an optional test selected by both the user and supply and therefore approved its transfer to section 3.10, Special Requirements. A final draft for Industry Review is planned for summer 2015.
The D-23 High Speed/High Frequency Base Materials Subcommittee found an additional handful of corrections needed to improve the IPC-4103A with Amendment 1. These will go out for comment to the final draft of Amendment 2, such that the rev A of the standard will issue as IPC-4103A with Amendments 1 and 2 prior to the fall 2015 IPC meetings in Rosemont, Ill.
Rigid Printed Boards
The D-31b IPC-2221/2222 Task Group reviewed proposed edits to a new working draft of IPC-2226A, Sectional Design Standard for HDI Printed Boards, which is the first revision effort for this standard since its original 2003 publication. One of the key aspects of revision revolves around Table 5-1, Typical Feature Sizes for HDI Construction. In addition to the work completed at this meeting, a subgroup of D-31b will make additional edits to the table and provide it back to the main task group in May 2015.
The D-33a Rigid Printed Board Performance Task Group met to begin the resolution of negative ballots and comments to the IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. The group focused on negative votes related to copper wrap plating for Class 3 product, microvia target land contact dimension requirements, evaluations of microsections in the “as-received” condition, thermal zones, and marking inks. The task group will continue to resolve comments associated with these negative ballots by way of web conferences in spring 2015.
The D-52 Embedded Component Materials Subcommittee held its first meeting as a reactivated standards development committee to begin work on revising IPC-4821, Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards. The two co-Chairs, John Bauer and Joel Peiffer, went through the group’s charter and the work ahead of them to properly revise the standard. The leaders are generating the needed TAEC PIN to begin the effort.
The D-35 Printed Board Storage and Handling Subcommittee met to review industry feedback to the working draft of IPC-1601A, Printed Board Handling and Storage Guidelines. The group added guidance and illustrations relative to marking and labeling for moisture sensitivity for bare printed boards, including cautionary text that avoids users from making the incorrect assumption that bare boards would have to meet the requirements of the IPC/JEDEC J-STD-033 specification, which is intended to address moisture sensitivity for components only.
The D-54 Embedded Devices Test Methods Subcommittee was also reactivated just prior to the 2015 IPC APEX EXPO event and is currently chaired by Jan Obrzut and soon to be vice chaired by Jason Ferguson of NSWC-Crane, as soon as funding is allowed for his efforts. Again, this subcommittee will assist in the work on revising the IPC-4821 to its Revision A.
The D-55 Embedded Devices Process Implementation Subcommittee met to celebrate publication of IPC-7092, Design and Assembly Process Implementation for Embedded Components, which describes the design and assembly challenges for implementing passive and active components in either formed or placed methodology inside a printed board. The subcommittee invites feedback for content that can be used for a possible revision or amendment.
The D-60 Printed Electronics Committee agreed to take an active role in mapping and coordinating printed electronics standards development.
The D-61 Printed Electronics Design Subcommittee determined that the A revision of IPC-2291 project may switch to a design standard for printed electronics to go in line with the IPC-222X design series. The subcommittee is now being led by Alan Burk, Almax, who will review the design documents and develop a skeleton document for the design standard this summer. Based on this, IPC-2291A may be retitled (and redesignated) as a design standard.
The D-62 Printed Electronics Base Materials Substrates Subcommittee is expanding the specification sheet for IPC/JPCA-4921A to allow for additional materials that are being used for printed electronics. The subcommittee is collaborating with the D-65 subcommittee on test methods to be added to the specification sheets.
The D-64 Printed Electronics Final Assembly Subcommittee reviewed the final draft for industry review of IPC-6901, Performance Requirements for Printed Electronics Assemblies. The meeting attendees recommended changing the name and scope of the document to better explain the document as is. The title of the document is now Application Categories for Printed Electronics. This change was approved by the subcommittee, and the document is now moving to ballot for planned publication by fall 2015.
The subcommittee is also beginning work on a performance standard for printed electronics to fit in the IPC-6010 series.
The D-65 Printed Electronics Test Methods Development Subcommittee continues to gather information on known test methods for printed electronics and investigating other non-printed electronics test methods that can be applied to printed electronics.
The D-66 Printed Electronics Processes Subcommittee is reviewing a proposed process guidelines standard from JPCA as another IPC/JPCA joint document on printed electronics. The subcommittee is also investigating the possibility of developing a process implementation standard that could be part of the IPC-709X series.