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Product Specialists Michael Bode and Geoffrey Hazlett join Guest Editor Dan Feinberg to talk about the company and its products and solutions. They also talked about some of the technologies being enabled by the company, including controlled impedance and insertion loss testing.
Watch the interview here.
Yuriy Shlepnev, Simberian
A typical PCB design usually starts with the material selection and stackup definition—the stackup planning or design exploration stage. How reliable are the data provided by the material vendors and PCB manufacturers? Can we use these data to predict trace width and spacing for the target trace impedance or to calculate delays or evaluate the loss budget?
John Coonrod, Rogers Corporation
Ready or not, 5G is coming, and it will require the right circuit materials for many different types of high-frequency circuits, including power amplifiers. 5G represents the latest and greatest in wireless technology, and it will be challenging to design and fabricate, starting with the circuit board materials, because it will operate across many different frequencies, such as 6 GHz and below, as well as at millimeter-wave frequencies (typically 30 GHz and above).
Andy Shaughnessy, Design007 Magazine
During DesignCon 2018, Andy Shaughnessy sat down for an interview with Martin Cotton, director of OEM projects for Ventec. Martin was a PCB designer for years, so he has experience on both sides of the desk. They discussed Ventec’s reasons for coming to DesignCon, their expansion into low-loss materials, and Ventec’s new I-Connect007 book, The Printed Circuit Designer’s Guide to Thermal Management with Insulated Metal Substrates.