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This paper, the fourth and final in a series downloaded by thousands of PCB designers, is dedicated to CAD library quality. It describes every aspect you need to consider when creating quad flat no-lead (QFN) component library parts.
It also describes the impact each feature has in the PCB process. To read this paper, click here.
Kelly Dack, CID+
PCB Libraries CEO Tom Hausherr and Editor Kelly Dack discuss PCB Libraries’ new BOM Builder service during IPC APEX EXPO. Equipped with the new LEAP technology, the BOM Builder can potentially save PCB designers days or weeks of time normally spent turning a BOM into a CAD library.
Gabriel Ciobanu, Continental Corp., and Boris Marovic, Mentor Graphics
Continental's automobile engineers have years of experience building critical parts and systems for automobiles. Making sure that automotive electronics are reliable, safe, and properly designed begins at the component level. Heat must be addressed early in the design process for these goals to be achieved. The most important thermal resistance for heat, outside the IC package, is the PCB.
Vern Solberg, Consultant
The designer is generally under pressure to release the documentation and get the flexible circuit into production. There is, however, a great deal at risk. Setting up for medium-to-high volume manufacturing requires significant physical and monetary resources. To avoid potential heat from management, the designer must insist on prototyping the product and a thorough design review prior to release.