Behind the Design: RAD


Reading time ( words)

This is the tenth post in a series showcasing the winners of the 2014 Technology Leadership Awards.View the previous ones here.

First place winner in the Telecom, Network Controllers, Line Cards category: RAD, Israel.

RAD-logo.png

Design: This board is the main card for 10GbE demarcation point for SLA-based Ethernet business services and mobile backhaul devices.

Design team:

  • Olga Goykhberg, Svetlana Zlotnik, Didier Halimi; Dorit Leizer, and Sharona Manasherov

Design challenges:

  • Considerations of cost savings dictated through hole via technology
  • Considerations of restricted board thickness dictated a maximum number of layers at 14
  • Variants: this board was designed for about 50 different device configurations, which contributed to complexity
  • 10GbE routing:
  • Thermal and mechanical constraints dictated device locations
  • Via minimization; plus no back drilling was allowed for cost reasons
  • Minimum 5mil lines to minimize skin effect
  • Impedance, length matching requirements
  • Localized plane islands were added to avoid critical signals crossing plane gaps
  • Used 0402 decoupling caps within via rows because they needed to be close to the chips and could not be placed on the back side since the design had through via breakouts
  • 95 planes were required within the design

RAD-Award-winning-design-520x429.jpg 

Design tools and team comments:

  • Xpedition® Enterprise
  • An aggressive schedule and high board required the use of Xpedition® concurrent team design technology.
  • The layout design ran concurrently with the electrical design, signal integrity and power integrity analysis.
  • During the layout flow there were lots of design changes. In spite of all of these changes, Xtreme Technology let us continue with the design progress because changing a particular section of the board does not interrupt the process in the other sections. In that way, the layout of the main board ended one day after the electrical development of the product was completed.

Judge’s comment:

  • “Difficult 10GbE and DDR/QDR routing.”

About the Technology Leadership Awards

Started in 1988, this program is the longest running competition of its kind in the electronic design automation (EDA) industry. It recognizes engineers and designers who use innovative methods and design tools to address today’s complex PCB systems design challenges and produce industry-leading products. See the full list of 2014 winners here.

Share


Suggested Items

Part 2: EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

02/19/2018 | Pete Starkey, I-Connect007
We continue with the rest of Pete Starkey’s report on Day 1 of the EIPC Winter Conference in Lyon, France. Included in this segment are presentations by Ventec, Ericsson, TTM and others, plus photos of their evening tour of Alstom.

Mentor Focusing on Power and Signal Integrity

02/05/2018 | Andy Shaughnessy, PCB Design007
Chuck Ferry is a product marketing manager at Mentor, and SI/PI product architect for HyperLynx tools. I spoke with Chuck recently during DesignCon 2018, and he shared some of his thoughts on the industry and Mentor’s plans for this year and beyond.

Nano Dimension’s 3D Printing: Prototypes at the Push of a Button?

01/26/2018 | Barry Matties, Publisher, I-Connect007
SICK AG is a global manufacturer of sensors and sensor solutions for industrial applications, with headquarters located in Waldkirch, Germany. After a demo of Nano Dimension’s new 3D printing machine at productronica, Barry Matties met with SICK’s Danny Wernet to discuss its pros and cons and get his overall impression of the technology. Are 3D prototypes really as simple as feeding in a Gerber file and pushing a button?



Copyright © 2018 I-Connect007. All rights reserved.